Datasheet > 73M2901CE-IGV

73M2901CE-IGV

更新时间： 2024-02-12 23:53:13

品牌	Logo	应用领域
东电化 - TDK		电信电信集成电路
页数	文件大小	规格书
19页	130K
描述
Modem, PQFP32

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技术参数
数据手册

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73M2901CE-IGV 技术参数

是否Rohs认证：	不符合	生命周期：	Transferred
Reach Compliance Code：	unknown	风险等级：	5.61
JESD-30 代码：	S-PQFP-G32	端子数量：	32
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	QFP
封装等效代码：	TQFP32,.35SQ,32	封装形状：	SQUARE
封装形式：	FLATPACK	电源：	3/3.3 V
认证状态：	Not Qualified	子类别：	Modems
最大压摆率：	15.5 mA	表面贴装：	YES
电信集成电路类型：	MODEM	温度等级：	INDUSTRIAL
端子形式：	GULL WING	端子节距：	0.8 mm
端子位置：	QUAD	Base Number Matches：	1

73M2901CE-IGV 数据手册

73M2901CE

V.22bis Single Chip Modem

APRIL 2004

DESCRIPTION

FEATURES

The 73M2901CE low speed modem integrates a

data pump, controller, and analog front end in a 3.3V

device with a powerful "AT" command host

interface. The modem reduces external component

count/cost by incorporating many features like

parallel phone detect, Line-In-Use and Ring

detection in software without additional components

required.

True one chip solution for embedded systems

As low as 9.5mA operating with standby and

power down mode available

Power supply operation from 3.6V to 2.7V

Data speed:

V.22bis – 2400bps

V.22/Bell212 – 1200bps

V.21/Bell103 – 300bps

V.23 – 1200/75bps (with PAVI turnaround)

Bell202 – 1200bps

Bell202/V23 4-wire operation

International Call Progress support

FCC68, CTR21, JATE, etc.

Worldwide Caller ID capability

Type I and II support

The device is a "one chip fits all” solution for

applications including set-top boxes, point-of-sale

terminals, automatic teller machines, utility meters,

vending machines and smart card readers.

Another distinctive feature of this device is pin

compatibility with TDK’s flagship embedded hard

modems, the 73M2901CL, and the 73M1903 soft

modem AFE. This offers customers a cost effective

method to design for both hard or soft modem

solutions in the same system as a risk-free cost

reduction path.

EIA 777 compliant

DTMF generation and detection

SMS messaging support

On chip hybrid driver

Blacklisting capability

Line-In-Use and Parallel Pick-Up (911) detection

with voltage or low cost energy detection method

Incoming ring energy detection through CID path;

no optocoupler required

Manufacturing Self Test capability

Backward compatible with 73M2901CL

Packaging:

Complete Support and Modem Reference Designs

Error correction software and support are part of the

solution offered by TDK Semiconductor. Our in-

house application engineering team is here to help

you meet your international certification needs.

32 lead QFN

32 pin TQFP packages

BLOCK DIAGRAM

Ó 2004 TDK Semiconductor Corporation

04/15/04- V2.2.1

12 3 4 5 6 7...19

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