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TDA9886TS/V5,118 PDF预览

TDA9886TS/V5,118

更新时间: 2024-01-19 12:57:29
品牌 Logo 应用领域
恩智浦 - NXP 光电二极管商用集成电路
页数 文件大小 规格书
56页 283K
描述
TDA9885; TDA9886 - I2C-bus controlled single and multistandard alignment-free IF-PLL demodulators SSOP2 24-Pin

TDA9886TS/V5,118 技术参数

生命周期:Obsolete零件包装代码:SSOP2
包装说明:SSOP,针数:24
Reach Compliance Code:unknownHTS代码:8542.31.00.01
风险等级:5.67Is Samacsys:N
商用集成电路类型:AUDIO/VIDEO DEMODULATOR解调类型:AM/FM
谐波失真:0.5%JESD-30 代码:R-PDSO-G24
长度:8.2 mm功能数量:1
端子数量:24最高工作温度:70 °C
最低工作温度:-20 °C输出电压标称(AM):500 mV
标称输出电压(调频):540 mV封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH认证状态:Not Qualified
座面最大高度:2 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V表面贴装:YES
温度等级:OTHER端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
宽度:5.3 mmBase Number Matches:1

TDA9886TS/V5,118 数据手册

 浏览型号TDA9886TS/V5,118的Datasheet PDF文件第50页浏览型号TDA9886TS/V5,118的Datasheet PDF文件第51页浏览型号TDA9886TS/V5,118的Datasheet PDF文件第52页浏览型号TDA9886TS/V5,118的Datasheet PDF文件第53页浏览型号TDA9886TS/V5,118的Datasheet PDF文件第54页浏览型号TDA9886TS/V5,118的Datasheet PDF文件第55页 
TDA9885; TDA9886  
NXP Semiconductors  
I2C-bus controlled multistandard alignment-free IF-PLL demodulators  
21. Contents  
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1  
16.4  
17  
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 52  
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 53  
Revision history . . . . . . . . . . . . . . . . . . . . . . . 54  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 4  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
18  
19  
Legal information . . . . . . . . . . . . . . . . . . . . . . 55  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 55  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
19.1  
19.2  
19.3  
19.4  
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 6  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7  
20  
21  
Contact information . . . . . . . . . . . . . . . . . . . . 55  
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
8
8.1  
8.2  
8.3  
8.4  
8.5  
8.6  
8.7  
Functional description . . . . . . . . . . . . . . . . . . . 8  
VIF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Tuner AGC and VIF AGC . . . . . . . . . . . . . . . . . 8  
VIF-AGC detector . . . . . . . . . . . . . . . . . . . . . . . 9  
FPLL detector . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
VCO and divider . . . . . . . . . . . . . . . . . . . . . . . . 9  
AFC and digital acquisition help . . . . . . . . . . . 10  
Video demodulator and amplifier . . . . . . . . . . 10  
Sound carrier trap. . . . . . . . . . . . . . . . . . . . . . 11  
SIF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
SIF-AGC detector . . . . . . . . . . . . . . . . . . . . . . 11  
Single reference QSS mixer . . . . . . . . . . . . . . 11  
AM demodulator . . . . . . . . . . . . . . . . . . . . . . . 12  
FM demodulator and acquisition help. . . . . . . 12  
Audio amplifier and mute time constant . . . . . 12  
Internal voltage stabilizer . . . . . . . . . . . . . . . . 13  
I2C-bus transceiver and MAD . . . . . . . . . . . . . 13  
8.8  
8.9  
8.10  
8.11  
8.12  
8.13  
8.14  
8.15  
8.16  
9
9.1  
I2C-bus control . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Read format . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Data byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Write format . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Subaddress (A data). . . . . . . . . . . . . . . . . . . . 17  
Data byte for switching mode (B data) . . . . . . 17  
Data byte for adjust mode (C data). . . . . . . . . 18  
Data byte for data mode (E data) . . . . . . . . . . 19  
9.1.1  
9.1.2  
9.2  
9.2.1  
9.2.2  
9.2.3  
9.2.4  
10  
11  
12  
13  
14  
15  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 21  
Thermal characteristics. . . . . . . . . . . . . . . . . . 21  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 22  
Application information. . . . . . . . . . . . . . . . . . 45  
Test information. . . . . . . . . . . . . . . . . . . . . . . . 46  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 48  
16  
Soldering of SMD packages . . . . . . . . . . . . . . 51  
Introduction to soldering . . . . . . . . . . . . . . . . . 51  
Wave and reflow soldering . . . . . . . . . . . . . . . 51  
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 51  
16.1  
16.2  
16.3  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 16 December 2008  
Document identifier: TDA9885_TDA9886_3  
 

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