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TDA7100HTMA1 PDF预览

TDA7100HTMA1

更新时间： 2024-02-22 00:01:02
品牌 Logo 应用领域
英飞凌 - INFINEON 电信光电二极管电信集成电路
页数 文件大小 规格书
41页 899K
描述
Telecom Circuit, 1-Func, PDSO10, GREEN, PLASTIC, TSSOP-10

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中文翻译

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TDA7100HTMA1 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSSOP
包装说明：TSSOP,针数：10
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：1.6JESD-30 代码：S-PDSO-G10
JESD-609代码：e3长度：3 mm
湿度敏感等级：1功能数量：1
端子数量：10最高工作温度：70 °C
最低工作温度：-20 °C封装主体材料：PLASTIC/EPOXY
封装代码：TSSOP封装形状：SQUARE
封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：NOT SPECIFIED
认证状态：Not Qualified座面最大高度：1.1 mm
标称供电电压：3 V表面贴装：YES
电信集成电路类型：TELECOM CIRCUIT温度等级：OTHER
端子面层：Tin (Sn)端子形式：GULL WING
端子节距：0.5 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：3 mm
Base Number Matches：1

TDA7100HTMA1 数据手册

 浏览型号TDA7100HTMA1的Datasheet PDF文件第1页浏览型号TDA7100HTMA1的Datasheet PDF文件第3页浏览型号TDA7100HTMA1的Datasheet PDF文件第4页浏览型号TDA7100HTMA1的Datasheet PDF文件第5页浏览型号TDA7100HTMA1的Datasheet PDF文件第6页浏览型号TDA7100HTMA1的Datasheet PDF文件第7页 
Edition 2007-05-02  
Published by Infineon Technologies AG,  
Am Campeon 1-12,  
85579 Neubiberg, Germany  
© Infineon Technologies AG 2007-05-02.  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as a guarantee of  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding  
circuits, descriptions and charts stated herein.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or the Infineon Technologies Companies and our Infineon Technologies  
Representatives worldwide (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in  
question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure  
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support  
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may  
be endangered.  
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