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TDA3MADBFABFQ1

更新时间： 2022-05-14 22:15:19
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德州仪器 - TI /
页数 文件大小 规格书
271页 4040K
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TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

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TDA3MADBFABFQ1 数据手册

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TDA3MV, TDA3MA, TDA3MD  
TDA3LX, TDA3LA  
SPRS964H –JUNE 2016–REVISED FEBRUARY 2020  
www.ti.com  
1.2 Applications  
•
Mono, stereo or tri-optic front camera  
•
LVDS or ethernet surround view  
–
–
–
–
–
–
–
–
Object detection  
–
–
–
–
–
–
–
2D surround view  
3D surround view  
Rear object detection  
Parking assist  
Pedestrian detection  
Traffic sign recognition  
Lane detection and departure warning  
Automatic emergency braking  
Adaptive cruise control  
Forward collision warning  
High beam assist  
Pedestrian detection  
Lane tracking  
Drive recording  
•
Sensor fusion – vision, radar, ultrasonic, lidar  
sensors  
–
–
Object data fusion  
Raw data fusion  
1.3 Description  
TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet  
the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables  
broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller  
form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-  
free driving experience.  
The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the  
industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar,  
and fusion on a single architecture.  
The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas  
Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores,  
Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in  
different package options (including Package-On-Package) to enable small form factor designs. TDA3x  
SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for  
LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.  
The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading  
the vision analytics functionality from the application processor while also reducing the power footprint.  
The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program  
execution and a vector coprocessor for specialized vision processing.  
Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor,  
including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a  
debugging interface for visibility into source code execution.  
The TDA3x ADAS processor is qualified according to AEC-Q100 standard.  
Device Information  
PART NUMBER  
TDA3LAxABFQ1  
TDA3MVxABFQ1  
TDA3MAxABFQ1  
TDA3MDxABFQ1  
TDA3LXxABFQ1  
PACKAGE  
FCBGA (367)  
FCBGA (367)  
FCBGA (367)  
FCBGA (367)  
FCBGA (367)  
BODY SIZE  
15.0 mm × 15.0 mm  
15.0 mm × 15.0 mm  
15.0 mm × 15.0 mm  
15.0 mm × 15.0 mm  
15.0 mm × 15.0 mm  
2
Device Overview  
Copyright © 2016–2020, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Links: TDA3MV TDA3MA TDA3MD TDA3LX TDA3LA  
 
 
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