Datasheet > TDA3LX

TDA3LX

更新时间： 2023-09-03 20:30:49

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
271页	3977K
描述
适用于 ADAS 应用且具有处理、成像和视觉加速功能的低功耗 SoC

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数据手册

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TDA3LX 数据手册

TDA3MV, TDA3MA, TDA3MD

TDA3LX, TDA3LA

ZHCSH24G –JUNE 2016–REVISED MARCH 2019

www.ti.com.cn

3 Device Comparison

表 3-1 shows a comparison between devices, highlighting the differences.

表 3-1. Device Comparison⁽²⁾⁽⁵⁾

FEATURES

DEVICE

TDA3MVx

TDA3MAx TDA3MDx

TDA3LXx

TDA3LAx

Features

CTRL_WKUP_STD_FUSE_DIE_ID_2 [31:24]

Base PN register bitfield value⁽⁴⁾⁽⁵⁾

TDA3MV: 147 (0x93)

TDA3MA: TDA3MD:

149 (0x95) 157 (0x9D)

TDA3LX: 154 (0x9A)

TDA3LA:

151 (0x97)

TDA3MV-FD: 148

(0x94)

TDA3LX–FD: 150

(0x96)

Processors/ Accelerators

Speed Grades

R, S

D, R, S

Yes

D, S

Yes

D, R, S

B, D, R, S B, D, R, S

C66x VLIW DSP

DSP1

Yes

DSP2

Display Subsystem

VOUT1

SD_DAC

Yes

Embedded Vision Engine (EVE) EVE1

Yes

Dual Arm Cortex-M4 Image

Processing Unit (IPU)

IPU1

Yes

Imaging Subsystem Processor

(ISS) with MIPI CSI-2 and CPI

ports

ISP

Yes

WDR & Mesh

LDC⁽¹⁾

CAL_A

CAL_B

LVDS-RX

CPI

Yes

Video Input VIP1

Port (VIP)

vin1a

vin1b

vin2a

vin2b

Program/Data Storage

On-Chip Shared Memory (RAM) OCMC_RAM

512kB

Yes

512kB

Yes

512kB

Yes

256kB

Yes

256kB

Yes

General-Purpose Memory

Controller (GPMC)

GPMC

LPDDR2/DDR2/DDR3/DDR3L

Memory Controller

EMIF1

(optional with

SECDED)

up to 2GB

up to 2GB up to 2GB

up to 2GB

Peripherals

Controller Area Network

Interface (CAN)

DCAN1

Yes

MCAN

Yes⁽³⁾

Yes

Yes⁽³⁾

Yes

Enhanced DMA (EDMA)

Embedded 8 channel ADC

EDMA

Yes

ADC

Ethernet Subsystem (Ethernet

SS)

GMAC_SW[0]

RGMII Only

RGMII

Only

RGMII

Only

RGMII Only

RGMII

Only

GMAC_SW[1]

RGMII Only

RGMII

Only

RGMII

Only

RGMII Only

RGMII

Only

General-Purpose IO (GPIO)

GPIO

Up to 126

Up to 126 Up to 126

Up to 126

Inter-Integrated Circuit Interface I2C

(I2C)

System Mailbox Module

MAILBOX

Device Comparison

1...3 4 567 8 9...271

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