Appendix: IC Revision history of SSD1305 Specification
Change Items
Version
Effective Date
1.0
Change to Advance Info.
27-Mar-06
1.1
Revise command 91h
28-Apr-06
Add a note on the capacitor value in Section 13 Application Example
Add I2C Interface
1.2
1.3
1.4
1.5
1.6
1.7
Revise CL pin description in Table 7-1
Revise Figure 10-6
26-Jun-06
17-Aug-06
06-Sep-06
22-Sep-06
21-Dec-06
16-May-07
Revise section 8.1.2 & Section 13
Add Figure 10-7
Remove software reset command (E2h)
Revise command 26h/27h/29h/2Ah (Set time interval between each scroll step)
Revise Figure 14-1 Application Example
Revise Die thickness to 457um from 475um
Revise “Bump Size” of pin “127-147, 294-314”
Revise Figure 10-6 ,Figure 8-5 , Figure 13-4
Add light sensitive note In Section 11 – Maximum ratings
Revise Note 2 in Section 8.10 Power ON/OFF sequence by adding the word
“disable”
Add China RoHS disclaimer at the last page.
1.8
1.9
For SPI/6800/8080 MCU interface, change the Rise / Fall time (tR/tF) to max. 40ns
Revise typo in SSD1305T6R1 dwg on P.68
pitch: From 0.85 change to 0.845
02-Aug-07
23-May-08
Add SSD1305Z3 in ordering information & add die tray
Revise CL pin to “connected to VSS” in Section 8.3
Revise typo in page 42 : from “upper column address is 00h” to “upper column
address is 10h”
27-Oct-08
2.0
Add IC revision history on spec
Solomon Systech
Oct 2008 P 2/71
Rev 2.0 SSD1305