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SPG32-182 PDF预览

SPG32-182

更新时间: 2024-01-09 00:21:27
品牌 Logo 应用领域
雷卯电子 - LEIDITECH /
页数 文件大小 规格书
5页 1016K
描述
Approximately zero leaking current before clamping voltage

SPG32-182 数据手册

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SPG32-501 Series  
Test Methods And Results  
Items  
Test Method  
Standard  
z
Measure starting discharge voltage (Vs) by gradually increasing  
applied DC voltage. Test current is 0.5mA max. And the  
DC Spark-over Voltage  
Insulation Resistance  
DC voltage ascends up within 100V/s(Vs 1000V) or 500V/  
<
s(Vs≥1000V).  
Meet specified value.  
Measure the insulation resistance across the terminal at regular  
voltage. But the test voltage doesn’t over the DC spark-over  
voltage.  
Measure the electrostatic capacitance by applying a voltage of  
less than 6V (at 1KHz) between terminals.  
Capacitance  
Static Life  
10KV with 1500pf condenser is discharged through 0Ω resistor.  
200 times at an interval of 10sec.  
Vs/Vs ≤30% Characteristics of other  
∣△ ∣  
items must meet the specified value.  
The following impulse current for specified current applied  
±5 times, each time interval 60 seconds. Thereafter, outer  
appearance shall be visually examined.  
Type  
Impulse current  
Vs < 400V  
1.2/50μs & 8/20μs, 3000A  
Surge Current Capacity  
No crack and no failures  
1.2/50μs & 8/20μs, 3000A, electrically  
connected with a resistor (1~2 Ω).  
Vs ≥ 400V  
Measurement after -40 /1000 HRS & normal temperature/2  
HRS.  
Cold Resistance  
Heat Resistance  
Humidity Resistance  
Measurement after 125 /1000 HRS & normal temperature/2  
HRS.  
Features are conformed to rated spec.  
Measurement after humidity 90~95  
normal temperature/2 HRS.  
(45  
) /1000 HRS &  
10 times repetition of cycle -40  
/30min →normal, temp/2 min  
Temperature Cycle  
Solder Ability  
→125 /30min, measurement after normal temp/2 HRS.  
Apply flux and immerse in molten solder 230±5 for 3sec up to  
Lead wire is evenly covered by solder.  
Conformed to rated spec.  
the point of 1.5mm from  
body. Check for solder adhesion.  
Measurement after lead wire is dipped up to the point of 1.5mm  
from body into 260±5 solder for 10sec.  
Solder Heat  
Pull Strength  
Apply 0.5kg load for 10sec.  
Lead shall not pull out to snap.  
Bend lead wire at the point of 2mm from body under 0.25 load  
and back to its original point.Repeat 1 time.  
Flexural Strength  
3/5  
Rev :01.06.2017  
www.leiditech.com  

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