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SMBJ300CA-TP PDF预览

SMBJ300CA-TP

更新时间: 2024-02-06 03:01:10
品牌 Logo 应用领域
美微科 - MCC 局域网光电二极管
页数 文件大小 规格书
9页 339K
描述
Trans Voltage Suppressor Diode, 600W, 300V V(RWM), Bidirectional, 1 Element, Silicon, DO-214AA, ROHS COMPLIANT, PLASTIC, SMB, 2 PIN

SMBJ300CA-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DO-214AA
包装说明:R-PDSO-C2针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.33
其他特性:UL RECOGNIZED最大击穿电压:371 V
最小击穿电压:335 V击穿电压标称值:353 V
最大钳位电压:486 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
最大非重复峰值反向功率耗散:600 W元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:BIDIRECTIONAL
认证状态:Not Qualified最大重复峰值反向电压:300 V
子类别:Transient Suppressors表面贴装:YES
技术:AVALANCHE端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10Base Number Matches:1

SMBJ300CA-TP 数据手册

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SMBJ5.0  
THRU  
SMBJ440CA  
M C C  
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20736 Marilla Street Chatsworth  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
Transient  
Voltage Suppressor  
5.0 to 440 Volts  
600 Watt  
For surface mount applicationsin order to optimize board space  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Fast response time: typical less than 1.0ps from 0 volts to  
VBR minimum  
Low inductance  
UL Recognized File # E331408  
DO-214AA  
(SMB) (LEAD FRAME)  
· Halogen free available upon request by adding suffix "-HF"  
Mechanical Data  
·
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
Terminals: solderable per MIL-STD-750, Method 2026  
G
Polarity: Color band denotes pos itive end (cathode)  
except Bidirectional  
H
Maximum soldering temperature: 260oC for 10 seconds  
D
Maximum Ratings @ 25oC Unless Otherwise Specified  
A
C
Peak Pulse Current on  
10/1000us waveform  
IPP  
See Table 1 Note: 2  
E
Peak Pulse Power  
PPP  
600W  
Note: 2,  
3
B
Dissipation  
F
-55oC to  
Operation And Storage TJ, TSTG  
Temperature Range  
+175oC  
DIMENSIONS  
Thermal Resistance  
RthJC  
RthJL  
25oC/W  
INCHES  
MIN  
MM  
MIN  
20oC/W  
DIM  
A
MAX  
.096  
.083  
.008  
.012  
.050  
.220  
.185  
.155  
MAX  
2.44  
2.11  
0.203  
0.305  
1.27  
5.59  
4.70  
3.94  
NOTE  
.083  
.075  
.002  
.006-  
.030  
.200  
.160  
.130  
2.13  
1.91  
0.051  
0.152  
0.76  
5.08  
4.06  
3.30  
B
C
D
E
F
G
H
SUGGESTED SOLDER  
PAD LAYOUT  
NOTES:  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
0.106"  
2. Non-repetitive current pulse, per Fig.3 and derated above  
TA=25oC per Fig.2.  
3. Mounted on 5.0mm2 copper pads to each terminal.  
0.082”  
4. Peak pulse current waveform is 10/1000us, with maximum duty  
Cycle of 0.01%.  
5. Unidirectional and bidirectional available,for bidirectional devices  
add 'C' suffix to the pn#, i.e.SMBJ5.0CA  
6. For bi-directional type having Vrwm of 10 Volts and less, the IR  
limit is double.  
0.050”  
www.mccsemi.com  
1 of 9  
Revision: E  
2013/07/18  

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