SM15T Series
Surface Mount TRANSZORB®
Transient Voltage Suppressor
Breakdown Voltage 6.8 to 220V
Peak Pulse Power 1500W
DO-214AB (SMC J-Bend)
0.185 MAX.
(4.69 MAX.)
0.126 (3.20)
0.114 (2.90)
0.245 (6.22)
0.220 (5.59)
0.121 MIN.
(3.07 MIN.)
0.060 MIN.
(1.52 MIN.)
0.280 (7.11)
0.260 (6.60)
0.012 (0.305)
0.006 (0.152)
0.320 REF
0.103 (2.62)
0.079 (2.06)
Mounting Pad Layout DO-214AB
Dimensions in inches
and (millimeters)
0.060 (1.52)
0.030 (0.76)
0.008
(0.203)
Max.
Features
0.320 (8.13)
0.305 (7.75)
• For surface mounted applications in order to optimize
board space • Low profile package • Built-in strain relief
• Glass passivated junction
Mechanical Data
Case: JEDEC DO-214AB (SMC) molded plastic over
• Low inductance
passivated junction
• Excellent clamping capability
• 1500W peak pulse power capability with a 10/1000µs
waveform, repetition rate (duty cycle): 0.01%
• Fast response time: theoretically (with no parisitic
inductance) less than 1ps from 0 Volts to V(BR) for
undirectional and 5ns for bidirectional types
• High temperature soldering: 250°C/10 seconds at terminals
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: For uni-directional types: Color band denotes
positive end (cathode)
Standard Packaging: 12mm tape (EIA STD RS-481)
Weight: 0.003 ounces, 0.093 grams
Packaging codes/options:
9/3.5K per 13” Reel (16mm Tape)
7/850 EA per 7” Reel (16mm Tape)
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
Value
Unit
Peak pulse power dissipation with
a 10/1000µs waveform (Notes 1, 2, Fig. 1)
PPPM
Minimum 1500
W
Peak pulse current with a 10/1000µs waveform (Note 1, Fig. 3)
IPPM
See Next Table
6.5
A
Power dissipation on infinite heatsink, TA = 50°C
PM(AV)
W
Peak forward surge current 10ms single half sine-wave
uni-directional only
IFSM
200
A
Maximum junction temperature
TJ
150
–65 to +175
75
°C
°C
Storage temperature range
TSTG
RθJA
RθJL
Thermal resistance junction to ambient air (Note 2)
Thermal resistance junction to leads
°C/W
°C/W
15
Notes: (1) Non-repetitive current pulse, per Fig.3 and derated above TA = 25°C per Fig. 2
(2) Mounted on 5.0mm2 (.013mm thick) land areas
6/13/00