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SiWG917M121XGT PDF预览

SiWG917M121XGT

更新时间: 2024-04-09 18:58:10
品牌 Logo 应用领域
芯科 - SILICON 电池无线
页数 文件大小 规格书
168页 3428K
描述
即将推出 SiWG917M121XGT SoC 是适用于需要长电池寿命的超低功耗物联网无线设备的理想之选。SiWG917M121XGT SoC 包括超低功耗 Wi-Fi? 6 及 Bluetoot

SiWG917M121XGT 数据手册

 浏览型号SiWG917M121XGT的Datasheet PDF文件第2页浏览型号SiWG917M121XGT的Datasheet PDF文件第3页浏览型号SiWG917M121XGT的Datasheet PDF文件第4页浏览型号SiWG917M121XGT的Datasheet PDF文件第5页浏览型号SiWG917M121XGT的Datasheet PDF文件第6页浏览型号SiWG917M121XGT的Datasheet PDF文件第7页 
SiWG917 SoC Single Chip Wi-Fi® and  
Bluetooth® LE Wireless Secure MCU  
Solutions  
Silicon Labs SiWG917 SoC is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 SoC, ideal  
for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP network-  
KEY FEATURES  
ing for secure cloud connectivity. It is optimal for developing battery operated devices  
• Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1  
stream IEEE 802.11 b/g/n/ax  
that need long battery life. SiWG917 SoC includes an ultra-low power Wi-Fi 6 plus Blue-  
tooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller  
(MCU) application subsystem, security, peripherals and power management subsystem  
all in a single 7x7 mm QFN package. The wireless subsystem consists of a multi-threa-  
ded processor (ThreadArch®) running up to 160 MHz, baseband digital signal process-  
ing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The appli-  
cation subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded  
• Bluetooth LE 5.4  
• Single chip Matter Over Wi-Fi Solution  
®
®
ARM Cortex M4 Processor with FPU  
subsystem up to 180 MHz with rich set of  
Digital and Analog Peripherals.  
SRAM, FLASH, ultra-low power sensor hub and AI/ML accelerator. The ARM® Cortex®-  
M4 is dedicated for peripheral and application-related processing, while the Threa-  
dArch® runs the wireless and networking stacks on independent threads, thus providing  
a fully integrated solution that is ready for a wide range of embedded wireless IoT appli-  
cations.  
• Wi-Fi 6 Benefits: TWT for improved  
efficiency and longer battery life, MU-  
MIMO/OFDMA for Higher Throughput,  
network capacity and low latency  
• Best in Class Device and Wireless  
Security  
SiWG917 applications include:  
• WLAN Tx power up to +20 dBm with  
integrated PA  
• Smart Home  
• Smart Cities  
• Bluetooth LE Tx power up to +19.5 dBm  
with integrated PA  
• Security Cameras  
• HVAC  
• Smart Meters  
• Industrial Wearables  
• Smart Buildings  
• Asset Tracking  
• Smart hospitals  
• WLAN Rx sensitivity as low as -97.5 dBm  
• Smart Sensors  
• Smart Appliances  
• Health and Fitness  
• Pet Trackers  
• Wi-Fi Standby Associated mode current:  
55 μA @ 1-second listen interval  
• Embedded Flash option up to 8 MB/  
optional external Flash up to 16 MB  
• Embedded PSRAM option up to 8 MB/  
optional external PSRAM option up to 16  
MB  
• Ultra-low power sensor hub peripherals  
• AI/ML Hardware Accelerator (MVP)  
• Embedded Wi-Fi, Bluetooth LE, Matter,  
and networking stacks supporting wireless  
coexistence  
• Three software-configurable MCU  
application memory options for sharing the  
RAM between the wireless, system, and  
application (192/256/320 kB)  
• Operating temperature: -40 ºC to +85 ºC  
• Wide operating supply range: 1.71 V to  
3.63 V  
silabs.com | Building a more connected world.  
Copyright © 2023 by Silicon Laboratories  
Preliminary Rev. 0.51  
This information applies to a product under development. Its characteristics and specifications are subject to change without notice.  

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