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SB80C188EC16

更新时间: 2024-02-13 17:06:00
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英特尔 - INTEL /
页数 文件大小 规格书
57页 787K
描述
16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS

SB80C188EC16 数据手册

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80C186EC/80C188EC AND 80L186EC/80L188EC  
16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS  
X
Fully Static Operation  
X
True CMOS Inputs and Outputs  
Y
Y
Integrated Feature Set:  
Ð Low-Power, Static, Enhanced 8086  
CPU Core  
Ð Two Independent DMA Supported  
UARTs, each with an Integral Baud  
Rate Generator  
Available in Extended Temperature  
b a  
Range ( 40 C to 85 C)  
§
§
Supports 80C187 Numerics Processor  
Y
Y
Extension (80C186EC only)  
Package Types:  
Ð 100-Pin EIAJ Quad Flat Pack (QFP)  
Ð 100-Pin Plastic Quad Flat Pack  
(PQFP)  
Ð 100-Pin Shrink Quad Flat Pack  
(SQFP)  
Ð Four Independent DMA Channels  
Ð 22 Multiplexed I/O Port Pins  
Ð Two 8259A Compatible  
Programmable Interrupt Controllers  
Ð Three Programmable 16-Bit Timer/  
Counters  
Ð 32-Bit Watchdog Timer  
Ð Ten Programmable Chip Selects with  
Integral Wait-State Generator  
Ð Memory Refresh Control Unit  
Ð Power Management Unit  
Ð On-Chip Oscillator  
Y
Y
Speed Versions Available (5V):  
Ð 25 MHz (80C186EC25/80C188EC25)  
Ð 20 MHz (80C186EC20/80C188EC20)  
Ð 13 MHz (80C186EC13/80C188EC13)  
Speed Version Available (3V):  
Ð 16 MHz (80L186EC16/80L188EC16)  
Ð 13 MHz (80L186EC13/80L188EC13)  
Ð System Level Testing Support  
(ONCE Mode)  
Y
Y
Direct Addressing Capability to 1 Mbyte  
Memory and 64 Kbyte I/O  
Low-Power Operating Modes:  
Ð Idle Mode Freezes CPU Clocks but  
Keeps Peripherals Active  
Ð Powerdown Mode Freezes All  
Internal Clocks  
Ð Powersave Mode Divides All Clocks  
by Programmable Prescalar  
The 80C186EC is a member of the 186 Integrated Processor Family. The 186 Integrated Processor Family  
incorporates several different VLSI devices all of which share a common CPU architecture: the 8086/8088.  
The 80C186EC uses the latest high density CHMOS technology to integrate several of the most common  
system peripherals with an enhanced 8086 CPU core to create a powerful system on a single monolithic  
silicon die.  
*Other brands and names are the property of their respective owners.  
Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or  
copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Intel retains the right to make  
changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.  
©
COPYRIGHT INTEL CORPORATION, 1996  
May 1996  
Order Number: 272434-004  

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