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S79FL256SDSMFVG03 PDF预览

S79FL256SDSMFVG03

更新时间: 2023-12-06 20:03:14
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
134页 2169K
描述
Dual QSPI Flash

S79FL256SDSMFVG03 数据手册

 浏览型号S79FL256SDSMFVG03的Datasheet PDF文件第1页浏览型号S79FL256SDSMFVG03的Datasheet PDF文件第2页浏览型号S79FL256SDSMFVG03的Datasheet PDF文件第3页浏览型号S79FL256SDSMFVG03的Datasheet PDF文件第5页浏览型号S79FL256SDSMFVG03的Datasheet PDF文件第6页浏览型号S79FL256SDSMFVG03的Datasheet PDF文件第7页 
256 Mb (32 MB) / 512 Mb (64MB) FL-S Flash  
SPI Dual-Quad, 3.0 V  
Table of contents  
Table of contents  
Features ...........................................................................................................................................1  
Performance summary ......................................................................................................................3  
Table of contents...............................................................................................................................4  
1 Overview .......................................................................................................................................6  
1.1 General description ................................................................................................................................................6  
2 SPI with multiple input / output (SPI-MIO) dual-quad.........................................................................7  
3 Signal descriptions .........................................................................................................................8  
3.1 Input/output summary...........................................................................................................................................8  
3.2 Multiple input / output (dual-quad SPI) ................................................................................................................8  
3.3 RESET#.....................................................................................................................................................................9  
3.4 Multiple Input / Output (Dual-Quad)......................................................................................................................9  
3.5 Serial Clock (SCK)....................................................................................................................................................9  
3.6 Chip Select (CS#).....................................................................................................................................................9  
3.7 Input Output IO0–IO7 .............................................................................................................................................9  
3.8 Core Voltage Supply (VCC).......................................................................................................................................9  
3.9 Versatile I/O Power Supply (VIO)...........................................................................................................................10  
3.10 Supply and Signal Ground (VSS) .........................................................................................................................10  
3.11 Not Connected (NC) ............................................................................................................................................10  
3.12 Reserved for Future Use (RFU) ...........................................................................................................................10  
3.13 Do Not Use (DNU)................................................................................................................................................10  
3.14 Block diagram .....................................................................................................................................................11  
4 Signal protocols............................................................................................................................12  
4.1 SPI clock modes ....................................................................................................................................................12  
4.2 Command protocol...............................................................................................................................................13  
4.3 Interface states .....................................................................................................................................................18  
4.4 Configuration Register effects on the Interface ..................................................................................................21  
4.5 Data protection.....................................................................................................................................................22  
5 Electrical specifications.................................................................................................................23  
5.1 Absolute maximum ratings ..................................................................................................................................23  
5.2 Thermal resistance ...............................................................................................................................................23  
5.3 Operating ranges ..................................................................................................................................................24  
5.4 Power-up and power-down..................................................................................................................................25  
5.5 DC characteristics .................................................................................................................................................27  
6 Timing specifications ....................................................................................................................28  
6.1 Key to switching waveforms.................................................................................................................................28  
6.2 AC test conditions .................................................................................................................................................29  
6.3 Reset ......................................................................................................................................................................30  
6.4 SDR AC characteristics..........................................................................................................................................32  
6.5 DDR AC characteristics .........................................................................................................................................34  
7 Physical interface .........................................................................................................................37  
7.1 Dual-Quad SOIC 16-lead package ........................................................................................................................37  
7.2 SOIC 16 physical diagram.....................................................................................................................................38  
8 Address space maps ......................................................................................................................39  
8.1 Overview................................................................................................................................................................39  
8.2 Flash memory array ..............................................................................................................................................40  
8.3 ID-CFI address space.............................................................................................................................................41  
8.4 OTP address space................................................................................................................................................41  
8.5 Registers................................................................................................................................................................44  
9 Data protection ............................................................................................................................56  
9.1 Secure silicon region (OTP) ..................................................................................................................................56  
9.2 Write Enable command ........................................................................................................................................57  
Datasheet  
4 of 134  
002-00518 Rev. *F  
2022-05-27  

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