Datasheet > S1M8674X01-V0T0

S1M8674X01-V0T0

更新时间： 2024-02-11 14:37:12

品牌	Logo	应用领域
三星 - SAMSUNG		电信信息通信管理光电二极管电信集成电路
页数	文件大小	规格书
10页	105K
描述
RF and Baseband Circuit, BICMOS, PDSO20, ETSSOP-20

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技术参数
数据手册

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S1M8674X01-V0T0 技术参数

生命周期：	Obsolete	零件包装代码：	TSSOP
包装说明：	TSSOP,	针数：	20
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.84	JESD-30 代码：	R-PDSO-G20
长度：	6.5 mm	功能数量：	1
端子数量：	20	最高工作温度：	80 °C
最低工作温度：	-30 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	TSSOP	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	认证状态：	Not Qualified
座面最大高度：	1.2 mm	标称供电电压：	3 V
表面贴装：	YES	技术：	BICMOS
电信集成电路类型：	RF AND BASEBAND CIRCUIT	温度等级：	COMMERCIAL EXTENDED
端子形式：	GULL WING	端子节距：	0.65 mm
端子位置：	DUAL	宽度：	4.4 mm
Base Number Matches：	1

S1M8674X01-V0T0 数据手册

TX RF FRONTS-ENDS IC

S1M8674

INTRODUCTION

20-eTSSOP-BD44

S1M8674 is a fully integrated RF transmit IC for CDMA handsets. It includes

an upconverter, a two-stage driver amplifier, and an LO buffer in

20TSSOP/24QFN (with exposed paddle) package. The driver amplifier

delivers over 4dBm output power with -65 dBc/30kHz ACPR while drawing

total current of under 40mA from 3.0V supply. The maximum output power is

larger than 10dBm for AMPS application. The gain of the driver amplifier can

be changed by an amount in 30dB to compensate for the gain variation of on-

chip & off-chip component ICs. The driver amplifier saves current at typical

condition due to the class AB operation.

The S1M8674 is ideally suited for CDMA/AMPS handset applications for low

power consumption.

24-QFN-3.5´ 4.5

The S1M8674 is fabricated using Samsung's 0.5mm BiCMOS process with low

cost and high yield.

The device package is shown in Figure 1. The block diagram and pin out of

the S1M8674 on 20TSSOP/24QFN PKG are shown in Figure 2a and 2b,

respectively. The pin description is found in table 1a and 1b, respectively. The

absolute maximum ratings of the S1M8674 are provided in Table 2, the

recommended operating conditions are specified in Table 3, and electrical

specifications are provided in Table 4.

FEATURES

Supports CDMA/AMPS application (824 to 849 MHz)

30 dB gain control range of the driver amplifier to compensate for the gain variation of on-chip & off-chip

components

Power amplifier driver which has high linearity

Power down control of the entire chip

20-Pin TSSOP/24-Pin QFN w/exposed paddle package

13 dB Attenuator is included for wide dynamic range.

ORDERING INFORMATION

Device

Package

Operating Temperature

-30 to +80°C

+ S1M8674X01-V0T0

20-eTSSOP-BD44

24-QFN-3.5´ 4.5

+ S1M8674X01-G0T0

+ : New product

-30 to +80°C

APPLICATIONS

Cellular CDMA/AMPS Hand-Held Phone

12 3 4 5 6 7...10

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