Datasheet > RH18G3R3B251

RH18G3R3B251

更新时间： 2024-04-09 18:56:34

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
13页	4191K
描述
0603, X8G, 3.3pF, 250Vdc

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

RH18G3R3B251 数据手册

Multilayer Ceramic Capacitors

Approval Sheet

10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS

No.

Item

Test Conditions

Requirements

1. Visual and

Mechanical

---

* No remarkable defect.

* Dimensions to conform to individual specification sheet.

2. Capacitance

3. Q/ D.F.

(Dissipation

Factor)

* Test temp.: Room Temperature.

1.0±0.2Vrms, 1MHz±10%

* Shall not exceed the limits given in the detailed spec.

* Q≥800+20C

* To apply voltage:

4. Dielectric

Strength

* No evidence of damage or flash over during test.

200V ~ 250V : 200% of rated voltage.

* Duration: 1 to 5 sec.

* Charge & discharge current less than 50mA.

5. Insulation

Resistance

* Test temp.: Room Temperature.

≥10GΩ or RxC≥100Ω-F whichever is smaller

* Capacitance change: within ±30ppm/°C;

≤100V : To apply rated voltage for max. 120 sec.

≥200V :To apply rated voltage (500V max.) for 60 sec.

With no electrical load.

6. Temperature

Coefficient

Operating temperature: -55~150°C at 25°C

7. Adhesive

Strength of

Termination

* Pressurizing force：

0402 to 0603: 5N

>0603: 10N

* No remarkable damage or removal of the terminations.

* Test time: 10±1 sec.

* Vibration frequency: 10~55 Hz/min.

* Total amplitude: 1.5mm

8. Vibration

Resistance

* No remarkable damage.

* Cap change and Q/D.F.: To meet initial spec.

* Test time: 6 hrs. (Two hrs each in three mutually

perpendicular directions.)

* Cap./DF(Q) Measurement to be made after de-aging at

150°C for 1hr then set for 24±2 hrs at room temp.

9. Solderability

10. Bending Test

* Solder temperature: 235±5°C

* Dipping time: 2±0.5 sec.

95% min. coverage of all metalized area.

* The middle part of substrate shall be pressurized by means

of the pressurizing rod at a rate of about 1 mm per second until

the deflection becomes 1 mm and then the pressure shall be

maintained for 5±1 sec.

* No remarkable damage.

* Cap change: within ±5.0% or ±0.5pF whichever is larger.

(This capacitance change means the change of capacitance under

specified flexure of substrate from the capacitance measured before

the test.)

* Measurement to be made after keeping at room temp. for

24±2 hrs.

* Solder temperature: 260±5°C

11. Resistance to

Soldering Heat

* No remarkable damage.

* Dipping time: 10±1 sec

* Cap change: within ±2.5% or ±0.25pF whichever is larger.

* Q/D.F., I.R. and dielectric strength: To meet initial requirements.

* 25% max. leaching on each edge.

* Preheating: 120 to 150°C for 1 minute before imme rse the

capacitor in a eutectic solder.

* Cap. / DF(Q) / I.R. Measurement to be made after de-aging

at 150°C for 1hr then set for 24±2 hrs at room temp .

* "Room condition" Temperature: 15 to 35°C, Relativ e humidity: 25 to 75%, Atmospheric pressure: 86 to 106kPa.

Page 9 of 13

ASC_Microwave_High_Reliability_RH

Feb. 2023

1...6 7 8910 11 12 13

中文翻译

下载PDF

与RH18G3R3B251相关器件

型号	品牌	获取价格	描述	数据表
RH18G3R6B251	WALSIN	获取价格	0603, X8G, 3.6pF, 250Vdc
RH18G3R9A251	WALSIN	获取价格	0603, X8G, 3.9pF, 250Vdc
RH18G3R9B251	WALSIN	获取价格	0603, X8G, 3.9pF, 250Vdc
RH18G4R0B251	WALSIN	获取价格	0603, X8G, 4.0pF, 250Vdc
RH18G4R3B251	WALSIN	获取价格	0603, X8G, 4.3pF, 250Vdc
RH18G4R7B251	WALSIN	获取价格	0603, X8G, 4.7pF, 250Vdc
RH18G5R0B251	WALSIN	获取价格	0603, X8G, 5.0pF, 250Vdc
RH18G5R1B251	WALSIN	获取价格	0603, X8G, 5.1pF, 250Vdc
RH18G5R6B251	WALSIN	获取价格	0603, X8G, 5.6pF, 250Vdc
RH18G5R6C251	WALSIN	获取价格	0603, X8G, 5.6pF, 250Vdc

与RH18G3R3B251相关文章

解读BAV99LT1数据手册：产品特性、电气参数及替换型号推荐
2024-06-18

1
资料解析：P82B96TD引脚图说明、电气参数
2024-06-18

1
ATA6621N数据手册解读：产品特性、引脚图信息、电气参数
2024-06-18

4
一文AO3400引脚图、参数、产品特性
2024-06-18

1

产品中心

服务支持

精选活动

关于我们

帮助中心

RH18G3R3B251

RH18G3R3B251 数据手册

与RH18G3R3B251相关器件

与RH18G3R3B251相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

RH18G3R3B251

RH18G3R3B251 数据手册

与RH18G3R3B251相关器件

与RH18G3R3B251相关文章

您还可以找

您在本页遇到什么问题？