Datasheet > R463N315000M2M

R463N315000M2M

更新时间： 2024-02-29 09:54:42

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
17页	1492K
描述
Metallized Polypropylene Film EMI Suppression Capacitors

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R463N315000M2M 数据手册

Metallized Polypropylene Film EMI Suppression Capacitors

R46 Series, Class X2, 310 VAC, 110ºC

Soldering Process

The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder.

Thisꢀhasꢀincreasedꢀtheꢀliquidusꢀtemperatureꢀfromꢀthatꢀofꢀ183ºCꢀforꢀSnPbꢀeutecticꢀalloyꢀtoꢀ217ꢀ–ꢀ221ºCꢀforꢀtheꢀnewꢀalloys.ꢀAsꢀaꢀ

result,ꢀtheꢀheatꢀstressꢀtoꢀtheꢀcomponents,ꢀevenꢀinꢀwaveꢀsoldering,ꢀhasꢀincreasedꢀconsiderablyꢀdueꢀtoꢀhigherꢀpre-heatꢀandꢀwaveꢀ

temperatures.ꢀPolypropyleneꢀcapacitorsꢀareꢀespeciallyꢀsensitiveꢀtoꢀheatꢀ(theꢀmeltingꢀpointꢀofꢀpolypropyleneꢀisꢀ160ꢀ–ꢀ170ºC).ꢀWaveꢀ

solderingꢀcanꢀbeꢀdestructive,ꢀespeciallyꢀforꢀmechanicallyꢀsmallꢀpolypropyleneꢀcapacitorsꢀ(withꢀleadꢀspacingꢀofꢀ5ꢀmmꢀtoꢀ15ꢀmm),ꢀ

andꢀgreatꢀcareꢀhasꢀtoꢀbeꢀtakenꢀduringꢀsoldering.ꢀTheꢀrecommendedꢀsolderꢀproﬁlesꢀfromꢀKEMETꢀshouldꢀbeꢀused.ꢀPleaseꢀconsultꢀ

KEMETꢀwithꢀanyꢀquestions.ꢀInꢀgeneral,ꢀtheꢀwaveꢀsolderingꢀcurveꢀfromꢀIECꢀPublicationꢀ61760-1ꢀEditionꢀ2ꢀservesꢀasꢀaꢀsolidꢀguidelineꢀ

for successful soldering. Please see Figure 1.

Reﬂowꢀsolderingꢀisꢀnotꢀrecommendedꢀforꢀthrough-holeꢀﬁlmꢀcapacitors.ꢀExposingꢀcapacitorsꢀtoꢀaꢀsolderingꢀproﬁleꢀinꢀexcessꢀofꢀtheꢀ

aboveꢀtheꢀrecommendedꢀlimitsꢀmayꢀresultꢀtoꢀdegradationꢀorꢀpermanentꢀdamageꢀtoꢀtheꢀcapacitors.ꢀ

Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert

through-holeꢀpartsꢀafterꢀtheꢀcuringꢀofꢀsurfaceꢀmountꢀparts.ꢀConsultꢀKEMETꢀtoꢀdiscussꢀtheꢀactualꢀtemperatureꢀproﬁleꢀinꢀtheꢀoven,ꢀ

if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended.

Pleaseꢀallowꢀtimeꢀforꢀtheꢀcapacitorꢀsurfaceꢀtemperatureꢀtoꢀreturnꢀtoꢀaꢀnormalꢀtemperatureꢀbeforeꢀtheꢀsecondꢀsolderingꢀcycle.

Manual Soldering Recommendations

Wave Soldering Recommendations

300

Following is the recommendation for manual

soldering with a soldering iron.

2+3s max

260°C

250

200

150

100

Firstwave

Second wave

Recommended Soldering Temperature

ΔT <150°C

Cooling

400

Preheating

ca 2°C/s

350

300

250

200

150

100

ca 3.5°C/s typical

ca 5°C/s

115°C max

T_preheat

100°C

Typical

120

160

200

240

Time (s)

Soldering time (sec)

The soldering iron tip temperature should

beꢀsetꢀatꢀ350°Cꢀ(+10°Cꢀmaximum)ꢀwithꢀtheꢀ

soldering duration not to exceed more than 3

seconds.

1...6 7 8910 11 12...17

中文翻译

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与R463N315000M2M相关器件

型号	品牌	获取价格	描述	数据表
R463N315000N0K	KEMET	获取价格	Metallized Polypropylene Film EMI Suppression Capacitors
R463N315000N0M	KEMET	获取价格	Metallized Polypropylene Film EMI Suppression Capacitors
R463N315000N1K	KEMET	获取价格	Metallized Polypropylene Film EMI Suppression Capacitors
R463N315000N1M	KEMET	获取价格	Metallized Polypropylene Film EMI Suppression Capacitors
R463N315000N2K	KEMET	获取价格	Metallized Polypropylene Film EMI Suppression Capacitors
R463N315000N2M	KEMET	获取价格	Metallized Polypropylene Film EMI Suppression Capacitors
R463N31504001K	KEMET	获取价格	Film Capacitor, Polypropylene, 630V, 10% +Tol, 10% -Tol, 0.15uF, Through Hole Mount, RADIA
R463N31504001M	KEMET	获取价格	Film Capacitor, Polypropylene, 630V, 20% +Tol, 20% -Tol, 0.15uF, Through Hole Mount, RADIA
R463N31505101K	KEMET	获取价格	Film Capacitor, Polypropylene, 630V, 10% +Tol, 10% -Tol, 0.15uF, Through Hole Mount, RADIA
R463N322050M1K	KEMET	获取价格	Film Capacitor, Polypropylene, 630V, 10% +Tol, 10% -Tol, 0.22uF, Through Hole Mount, RADIA

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