Datasheet > PR0805FKM070R05

PR0805FKM070R05

更新时间： 2024-02-08 06:07:38

品牌	Logo	应用领域
国巨 - YAGEO		传感器
页数	文件大小	规格书
10页	332K
描述
CURRENT SENSOR - LOW TCR

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PR0805FKM070R05 数据手册

Product specification

SERIES

0805/1206/2512/0815

PR/PF/PH

Chip Resistor Surface Mount

TESTS AND REQUIREMENTS

Table 4 Test condition, procedure and requirements

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

MIL-STD-202G-method 108A

IEC 60115-1 4.25.1

JIS C 5202-7.10

Life/

1,000 hours at 70±5 °C applied RCWV

1.5 hours on, 0.5 hour off, still air required

±(1%+0.0005 Ω)

Operational Life/

Endurance

MIL-STD-202G-method 108A

IEC 60115-1 4.25.3

High

Temperature

Exposure/

Endurance at

Upper Category

Temperature

1,000 hours at maximum operating temperature

depending on specification, unpowered

±(1%+0.0005 Ω)

No direct impingement of forced air to the parts

Tolerances: 155±3 °C

JIS C 5202-7.11

MIL-STD-202G-method 106F

IEC 60115-1 4.24.2

Moisture

Resistance

Each temperature / humidity cycle is defined at 8

hours (method 106F), 3 cycles / 24 hours for 10d

with 25 °C / 65 °C 95% R.H, without steps 7a &

7b, unpowered

±(0.5%+0.0005 Ω)

Parts mounted on test-boards, without

condensation on parts

Measurement at 24±2 hours after

test conclusion

MIL-STD-202G-method 107G

Thermal Shock

-55/+155 °C

±(0.5%+0.0005 Ω)

Note: Number of cycles required is 300. Devices

unmounted

Maximum transfer time is 20 seconds. Dwell time

is 15 minutes. Air – Air

MIL-R-55342D-para 4.7.5

IEC60115-1 4.13

Short Time

Overload

5 times of rated power for 5 seconds at room

temperature

±(0.5%+0.0005 Ω)

No visible damage

IEC60115-1 4.33

Board Flex/

Bending

Device mounted on PCB test board as described,

only 1 board bending required

±(1%+0.05 Ω)

No visible damage

Bending for 0805: 3 mm

1206/2512/other: 2 mm

Holding time: minimum 60 seconds

www.yageo.com

Nov 01, 2011 V.0

1...5 6 789 10

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