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PIC16C55A/JW PDF预览

PIC16C55A/JW

更新时间： 2024-01-13 18:23:22
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器时钟微控制器外围集成电路
页数 文件大小 规格书
12页 412K
描述
8-BIT, OTPROM, 20 MHz, RISC MICROCONTROLLER, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, MO-103, DIP-28

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PIC16C55A/JW 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：DIP
包装说明：0.600 INCH, WINDOWED, CERAMIC, MO-103, DIP-28针数：28
Reach Compliance Code：compliantHTS代码：8542.31.00.01
风险等级：5.03具有ADC：NO
地址总线宽度：位大小：8
CPU系列：PIC最大时钟频率：20 MHz
DAC 通道：NODMA 通道：NO
外部数据总线宽度：JESD-30 代码：R-CDIP-T28
JESD-609代码：e3长度：37.08 mm
I/O 线路数量：20端子数量：28
片上程序ROM宽度：12最高工作温度：70 °C
最低工作温度：PWM 通道：NO
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装代码：WDIP
封装等效代码：DIP28,.6封装形状：RECTANGULAR
封装形式：IN-LINE, WINDOW峰值回流温度（摄氏度）：NOT SPECIFIED
电源：2.5/6.25 V认证状态：Not Qualified
RAM（字节）：24ROM（单词）：512
ROM可编程性：UVPROM座面最大高度：5.72 mm
速度：20 MHz子类别：Microcontrollers
最大供电电压：5.5 V最小供电电压：4.5 V
标称供电电压：5 V表面贴装：NO
技术：CMOS温度等级：COMMERCIAL
端子面层：Matte Tin (Sn)端子形式：THROUGH-HOLE
端子节距：2.54 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：15.24 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISCBase Number Matches：1

PIC16C55A/JW 数据手册

 浏览型号PIC16C55A/JW的Datasheet PDF文件第2页浏览型号PIC16C55A/JW的Datasheet PDF文件第3页浏览型号PIC16C55A/JW的Datasheet PDF文件第4页浏览型号PIC16C55A/JW的Datasheet PDF文件第5页浏览型号PIC16C55A/JW的Datasheet PDF文件第6页浏览型号PIC16C55A/JW的Datasheet PDF文件第7页 
MPLAB® ICE 2000  
Processor Module and Device Adapter Specification  
CONTENTS  
2.0  
MPLAB ICE 2000 SYSTEM  
1.0 Introduction......................................................... 1  
2.0 MPLAB ICE 2000 System................................... 1  
3.0 Emulator-Related Issues .................................... 2  
4.0 Processor Modules............................................. 2  
5.0 Device Adapter Issues........................................ 4  
A brief overview of the different components of the  
system is shown in the figure below. Each component  
is discussed in the following subsections.  
FIGURE 2-1: MPLAB ICE 2000 EMULATOR  
SYSTEM  
Host to Pod Cable  
Emulator Pod  
1.0  
INTRODUCTION  
Processor Module  
The processor modules for MPLAB ICE 2000 are  
interchangeable personality modules that allow  
MPLAB ICE 2000 to be reconfigured for emulation of  
Flexible Circuit  
Cable  
Logic Probe  
®
different PICmicro microcontrollers (MCUs). This  
Connector  
modularity allows the emulation of many different  
devices with the addition of a processor module and  
device adapter, which provides a very cost effective  
multiprocessor emulation system.  
Device  
Adapter  
Transition  
Socket  
The device adapters for MPLAB ICE 2000 are inter-  
changeable assemblies that allow the emulator system  
to interface to a target application system. device  
adapters also have control logic that allows the target  
application to provide a clock source and power to the  
processor module. The device adapters support  
PICmicro MCUs in DIP, SDIP and PLCC packages.  
2.1  
Host to Pod Cable  
This is a standard parallel interface cable. MPLAB ICE  
2000 is tested with a 6-foot cable. A longer cable may  
work, but is not guaranteed. The cable connects to a  
parallel port on the PC. If a PC has a printer connected  
to an LPT device, it is recommended that an additional  
interface card be installed, rather than using a splitter  
or an A/B switch.  
Transition Sockets, used along with a device adapter,  
provide a method of accommodating all PICmicro MCU  
packages, including SOIC, SSOP, PQFP and TQFP  
packages.  
2.2  
Emulator Pod  
The Emulator Pod contains emulator memory and  
control logic. MPLAB ICE 2000 contains a main board  
and an additional board for expanded trace memory  
and complex control logic. There are no field service-  
able parts in the pod. For more information on the pod,  
see the MPLAB ICE 2000 on-line help file in MPLAB  
IDE (Help>Topics) or the MPLAB ICE 2000 User’s  
Guide (DS51488).  
The MPLAB ICE 2000 processor module is inserted  
into the pod for operation.  
2.3  
Processor Module  
The processor module contains the emulator chip, logic  
and low-voltage circuitry. There are no field serviceable  
parts mounted on the printed circuit board housed  
within the processor module enclosure.  
2004 Microchip Technology Inc.  
DS51140J-page 1  
 
 
 
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