PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
RoHS Pb
PGB1 Series Lead-Free 0805 ESD Suppressor
Capacitance vs. Frequency
Electrical Characteristics
ESD Capability
** Note: 1,000 fF = 1 pF
70
IEC 61000-4-2 Direct Discharge ....................................................8kV
IEC 61000-4-2 Air Discharge .......................................................15kV
Trigger Voltage1 .....................................................................500 V, typical
Clamping Voltage1..................................................................150V, typical
Rated Voltage ........................................................................24VDC, max
Capacitance2................................................................................0.055 pF
Response Time1................................................................................< 1ns
Leakage Current3 .............................................................................< 1nA
ESD Pulse Withstand4 ..........................................1,000 pulses, minimum
60
50
40
4
0.5
1.0
1.5
2.0
Notes:
Frequency (GHz)
1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct
discharge method.
2. Capacitance measured at 1MHZ.
3. Leakage current measured at 6VDC.
4. Pulse Withstand- some shifting in characteristics may occur when tested
over multiple pulses at a very rapid rate.
Carrier Tape Specifications
Parts are delivered on 7" (178mm) reel, paper carrier tape
Environmental Specifications
Operating Temperature: -65°C to +125°C.
Moisture Resistance, steady state: MIL-STD-833, method 1004.7,
85% RH, 85°C, 1000hrs.
Tt
Ds
Dd
Thermal Shock: MIL-STD-202, Method 107G, -65°C to 125°C,
30 min cycle, 10 cycles.
+
+
+
+
Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz,
1 min. cycle, 2grs each in X-Y-Z)
Chemical Resistance: ASTM D-543, 4hrs @ 40°C, 3 solutions (H2O,
detergent solution, defluxer)
Tw
+
+
+
Ph
Pd
Solder leach resistance and terminal adhesion: Per EIA-576
test
Pw
Ps
Ct
Physical Specifications
Materials:
Body: Glass Epoxy
Terminations: 100% Copper/Nickel/Tin
Solderability: MIL-STD-202, Method 208 (95% coverage)
Soldering Parameters:
Wave Solder – 260°C, 10 seconds maximum.
Reflow Solder – 260°C, 30 seconds maximum.
DESCRIPTION
MEASUREMENT (MM)
Ct - Cover tape thickness
Dd - Drive hole diameter
Ds - Drive hole spacing
Pd - Pocket depth
0.06
1.50
4.00
0.58
2.21
4.00
1.45
0.65
8.00
Packaging Specifications
8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per
reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR.
Ph - Pocket height
Ps - Pocket spacing
Pw - Pocket width
Tt - Carrier tape thickness
Tw - Carrier tape width
207
www. lit t elf us e. c om