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PGB102ST23 PDF预览

PGB102ST23

更新时间: 2024-01-26 09:36:38
品牌 Logo 应用领域
力特 - LITTELFUSE 瞬态抑制器二极管光电二极管局域网
页数 文件大小 规格书
4页 704K
描述
Surface Mount Polymeric ESD Suppressors

PGB102ST23 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:1.18Samacsys Description:Littelfuse 24 V dc PGB1 ESD Suppressor, Surface Mount Mounting
其他特性:LOW CAPACITANCE配置:COMPLEX
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码:R-PDSO-N3JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:3封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:BIDIRECTIONAL
认证状态:Not Qualified表面贴装:YES
技术:AVALANCHE端子面层:MATTE TIN
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:30

PGB102ST23 数据手册

 浏览型号PGB102ST23的Datasheet PDF文件第1页浏览型号PGB102ST23的Datasheet PDF文件第2页浏览型号PGB102ST23的Datasheet PDF文件第4页 
PulseGuard® Suppressors  
Surface Mount Polymeric ESD Suppressors  
Physical Specifications  
Environmental Specifications  
Body: Glass Epoxy  
Terminations: Copper/Nickel/Tin  
Operating Temperature  
Moisture Resistance  
-65°C to +125°C  
Materials  
0402 series:  
40°C, 95% RH, 1000 hours  
Solderability  
MIL-STD-202, Method 208  
0603, ST23:  
Soldering  
Parameters  
Wave solder - 260°C, 10 seconds maximum  
Reflow solder - 260°C, 30 seconds maximum  
85°C, 85% RH, 1000 hours  
MIL-STD-202, Method 107,  
-65°C to 125°C, 30 min. cycle,  
10 cycles  
Thermal Shock  
Design Consideration  
MIL-STD-202, Method 201,  
(10 to 55 to 10 Hz, 1 min.  
cycle, 2 hrs each in X-Y-Z)  
Because of the fast rise-time of the ESD transient, proper  
placement of PulseGuard suppressors are a key design  
consideration to achieving optimal ESD suppression. The  
devices should be placed on the circuit board as close to the  
source of the ESD transient as possible. Install PulseGuard  
suppressors (connected from signal/data line to ground)  
directly behind the connector so that they are the first board-  
level circuit component encountered by the ESD transient.  
Vibration  
Chemical Resistance  
MIL-STD-202, Method 215  
IPC/EIA J-STD-002  
Solder Leach Resistance and  
Terminal Adhesion  
Soldering Parameters  
Reflow Condition  
- Temperature Min (T  
Pb – Free assembly  
)
150°C  
s(min)  
Pre Heat - Temperature Max (T  
)
200°C  
s(max)  
- Time (min to max) (ts)  
60 – 180 seconds  
Average ramp up rate (Liquidus Temp  
(TL) to peak  
3°C/second max  
TS(max) to TL - Ramp-up Rate  
3°C/second max  
- Temperature (TL) (Liquidus) 217°C  
Reflow  
- Temperature (tL)  
60 – 150 seconds  
260°C  
Peak Temperature (TP)  
Based on IPC/JEDEC J-STD-020  
Time within 5°C of actual peak  
Temperature (tp)  
10 – 30 seconds  
Ramp-down Rate  
6°C/second max  
8 minutes max  
Time 25°C to peak Temperature (TP)  
3
PGB1 Series  
www.littelfuse.com  
©2007 Littelfuse  
Electronics Designers Guide  
Specifications are subject to change without notice.  

PGB102ST23 替代型号

型号 品牌 替代类型 描述 数据表
PGB102ST23WR LITTELFUSE

功能相似

PulseGuard Suppressors - Surface Mount Polymeric ESD Suppressors

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