Datasheet > P21BN300M5S

P21BN300M5S

更新时间： 2024-02-07 07:18:34

品牌	Logo	应用领域
迪尔艾爱提 - DILABS		/
页数	文件大小	规格书
5页	389K
描述
Milli.Cap: The Ideal SMT Capacitor

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P21BN300M5S 数据手册

Recommended Attachment Methods (Continued)

Recommended Attachment to Soft or Hard Substrate Using Solder:

Recommended Micro‐Strip Layout:

Gap:

.008” - .010”

Solder Thickness:

.004” - .006”

Ideal Micro Strip Width:

.012” - .015”

Solder Diameter:

.010 - .015”)

Distance from Trace Edge:

.001” - .002”

Attachment Method:

1. Place a single drop of solder paste onto each micro‐strip line as illustrated. The

edge of the solder paste shall be at least 0.001"‐0.002" back from the edge of the

trace to prevent filling the gap with solder.

2. Centering the termination gap of the capacitor within the gap in the micro‐strip,

press with careful, even pressure onto the micro‐strip ensuring the terminations

make good contact with the drops of solder paste.

3. Reflow according to the solder manufacturer's preferred profile, ensuring the

reflow temperature does not exceed 250°C.

4. After the reflow step is completed, inspect the joint for voids or excess flux and

non‐reflowed solder balls that can degrade performance or cause shorts across the

gaps. Proper cleaning after the reflow process is crucial to avoiding performance

degradation and discovering poor solder joints.

Isopropanol and Methanol are both safe to use with soldered Milli‐Caps ®

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