Technical Note
P02221B2P
500mW InGaP HBT Amplifier
□Place more than 2 machine screws as close to the ground
pin (pin 4) as possible. The PCB is screwed on the
mounting plate or the heat sink to lower the thermal
resistance of the PCB.
♦Attention to Heat Radiation
In the layout design of the printed circuit board (PCB) on
which the InGaP HBT Amplifier are attached, the heat
radiation to minimize the device junction temperature should
be taken into account, since it significantly affects the MTTF
and RF performance. In any environment, the junction
temperature should be lower than the absolute maximum
rating during the device operation and it is recommended
that the thermal design has enough margin.
□Lay out a large ground pad area with multiple plated thru
holes around pin 4 of the device.
□The required matching and feedback circuit described in
the application circuit examples should be connected to the
device, although it is not shown in the figure below.
The junction temperature can be calculated by the following
formula.
[Using Heat Sink]
Tjmax=(Vd*Id-Pout)(Rth+Rboard+Rhs)+Ta
φ3 Pllaatteedd TThhrruu HHoollee
forr 22..55 MMaacchhiinnee SSccrreewwss
Vd: Device voltage
4-R0..33
φ5 SSoollddeerrmmaasskk KKeeeeppoouutt
Id: Device current
2
Pout: Output power
φ0.4 PPllaatteedd TThhrruu HHoolleess
HHeatssiinnkk
Rth: Thermal resistance between junction and case
Rboard: Thermal resistance of PCB
Rhs: Thermal resistance of heat sink
Ta:Ambient temperature
1
.
99×2..885
((4-R00..33))
Grandd PPllaannee
Packaaggee OOuuttlliinnee
Tjmax: Maximum junction temperature
Grandd PPllaannee
φ3 Pllaatteedd TThhrruu HHoollee
Generally, there are two ways of heat radiation. One is the
plated thru hole and the other is the heat sink. Key points will
be illustrated in each case below. Note that no measure
against oscillation is adopted in the figures. In the design of
circuit and layout, you should take stabilizing into account if
necessary.
forr 22..55 MMaacchhiinnee SSccrreewwss
φ5 SSoollddeerrmmaasskk KKeeeeppoouutt
If you cannot get the junction temperature lower than the
absolute maximum rating only with the plated thru holes,
then you need to employ the heat sink. Attaching the heat
sink directly under pin 4 of the device improves the thermal
resistance between junction and ambient.
[Using Thru Hole]
φ
3 Plated Thru Hole
for 2.5 Machine Screws
[Note]
φ
5 Soldermask Keepout
0.3 Plated Thru Holes
□Ground/thermal vias are critical for the proper device
performance. Drills of the recommended diameters should
be used in the fabrication of vias.
φ
Package Outline
φ
0.4 Plated Thru Holes
□Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
□Mounting screws can be added near the part to fasten the
board to heat sink. Ensure that the ground/thermal via
region contacts the heat sink.
Grand Plane
φ
5 Soldermask
Keepout
φ
3 Plated Thru Hole
for 2.5 Machine Screws
□Do not put solder mask on the backside of the PCB in the
region where the board contacts the heat sink.
□RF trace width depends upon the PCB material and
construction.
□Multiple plated thru holes are required directly below the
□Use 1 oz. Copper minimum.
device.
Specifications and information are subject to change without notice.
2005-07
Eudyna Devices Inc. 1,Kanai-cho, Sakae-ku, Yokohama, 244-0845 Japan
Phone : +81-45-853-8150 Fax : +81-45-853-8170 e-mail : www-sales-s@eudyna.com Web Site : www.eudyna.com
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