OPA990, OPA2990, OPA4990
ZHCSJC8I –FEBRUARY 2019 –REVISED AUGUST 2021
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• 阐明了引脚功能部分中OPA4990S 的SHDN 符号............................................................................................. 4
Changes from Revision E (December 2019) to Revision F (May 2020) Page
• 从器件信息表中删除了OPA2990 X2QFN (10) 封装的预发布符号.................................................................... 1
• 删除了引脚配置和功能部分中OPA2990S RUG 封装(X2QFN) 中的预览符号................................................... 4
• 更改了双通道热性能信息部分中的RUG (X2QFN)............................................................................................ 4
Changes from Revision D (July 2019) to Revision E (December 2019)
Page
• 将OPA990 和OPA4990 器件状态从预告信息更改为量产数据........................................................................ 1
• 从器件信息表中删除了OPA990 SOT-23 (5) 封装的预发布符号........................................................................1
• 从器件信息表中删除了OPA990S SOT-23 (6) 封装的预发布符号......................................................................1
• 从器件信息表中删除了OPA990 SC70 (5) 封装的预发布符号........................................................................... 1
• 从器件信息表中删除了OPA4990 SOIC (14) 封装的预发布符号........................................................................1
• 从器件信息表中删除了OPA4990 TSSOP (14) 封装的预发布符号.................................................................... 1
• 删除了引脚配置和功能部分中OPA990 DBV 封装(SOT-23) 中的预览符号........................................................4
• 删除了引脚配置和功能部分中OPA990 DCK 封装(SC70) 中的预览符号...........................................................4
• 删除了引脚配置和功能部分中OPA4990 D (SOIC) 和TSSOP (PW) 封装中的预览符号.................................... 4
• 删除了引脚配置和功能部分中OPA990S DBV 封装(SOT-23) 中的预览符号..................................................... 4
Changes from Revision C (May 2019) to Revision D (July 2019)
Page
• 从器件信息表中删除了OPA2990 WSON (8) 封装的预发布符号....................................................................... 1
• 删除了引脚配置和功能部分中OPA2990 DSG 封装(WSON) 中的预览符号.......................................................4
• 向”电气特性“表中添加了”关断“................................................................................................................ 13
• 向详细说明部分中添加了关断部分....................................................................................................................32
Changes from Revision B (April 2019) to Revision C (May 2019)
Page
• 从器件信息表中删除了OPA2990 TSSOP (8) 封装的预发布符号...................................................................... 1
• 删除了引脚配置和功能部分中OPA2990 PW 封装(TSSOP) 中的预览符号........................................................4
Changes from Revision A (March 2019) to Revision B (April 2019)
Page
• 从器件信息表中删除了OPA2990 SOIC (8) 封装的预发布符号..........................................................................1
• 删除了引脚配置和功能部分中OPA2990 D 封装(SOIC) 中的预览符号.............................................................. 4
Changes from Revision * (February 2019) to Revision A (March 2019)
Page
• 将OPA2990 器件状态从预告信息更改为量产数据........................................................................................... 1
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Product Folder Links: OPA990 OPA2990 OPA4990