5秒后页面跳转
NE556N PDF预览

NE556N

更新时间: 2024-01-05 06:47:46
品牌 Logo 应用领域
恩智浦 - NXP 模拟波形发生功能信号电路光电二极管
页数 文件大小 规格书
5页 107K
描述
Dual timer

NE556N 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP14,.3Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:R-PDIP-T14
JESD-609代码:e0端子数量:14
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP14,.3封装形状:RECTANGULAR
封装形式:IN-LINE电源:5/15 V
子类别:Analog Waveform Generation Functions表面贴装:NO
技术:BIPOLAR温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
Base Number Matches:1

NE556N 数据手册

 浏览型号NE556N的Datasheet PDF文件第1页浏览型号NE556N的Datasheet PDF文件第3页浏览型号NE556N的Datasheet PDF文件第4页浏览型号NE556N的Datasheet PDF文件第5页 
Philips Semiconductors Linear Products  
Product specification  
Dual timer  
NE/SA/SE556/NE556-1  
EQUIVALENT SCHEMATIC (Shown for one circuit only)  
CONTROL VOLTAGE  
V
CC  
R2  
330  
R1  
4.7K  
R3  
4.7K 1K  
R4  
R7  
5K  
R12  
6.8K  
Q5  
Q6 Q7  
Q21  
Q9  
Q8  
Q22  
Q19  
R13  
3.3K  
Q4  
THRESHOLD  
Q1  
R10  
3.2  
K
Q2 Q3  
OUTPUT  
Q23  
C
B
CB  
Q18  
E
R11  
4.7K  
R5  
10K  
Q20  
R8  
5K  
Q11 Q12  
R14  
220  
TRIGGER  
RESET  
Q17  
Q10  
Q13  
Q24  
Q16  
Q25  
Q15  
DISCHARGE  
GND  
R15  
4.7K  
R6  
100K  
R9  
5K  
Q14  
R16  
100  
ORDERING INFORMATION  
DESCRIPTION  
14-Pin Plastic Small Outline (SO) Package  
14-Pin Ceramic Dual In-Line Package (CERDIP)  
14-Pin Plastic Dual In-Line Package (DIP)  
14-Pin Ceramic Dual In-Line Package (CERDIP)  
14-Pin Plastic Dual In-Line Package (DIP)  
14-Pin Plastic Dual In-Line Package (DIP)  
14-Pin Ceramic Dual In-Line Package (CERDIP)  
14-Pin Plastic Dual In-Line Package (DIP)  
TEMPERATURE RANGE  
0 to +70°C  
ORDER CODE  
NE556D  
DWG #  
0175D  
0581B  
0405B  
0581B  
0405B  
0405B  
0581B  
0405B  
0 to +70°C  
NE556F  
0 to +70°C  
NE556N  
0 to +70°C  
NE556-1F  
NE556-1N  
SA556N  
0 to +70°C  
-40°C to +85°C  
-55°C to +125°C  
-55°C to +125°C  
SE556F  
SE556N  
ABSOLUTE MAXIMUM RATINGS  
SYMBOL  
PARAMETER  
RATING  
UNIT  
V
CC  
Supply voltage  
NE/SA556, NE556-1  
SE556  
+16  
+18  
800  
V
V
1
P
Maximum allowable power dissipation  
Operating temperature range  
NE556-1, NE556  
mW  
D
T
A
0 to +70  
-40 to +85  
-55 to +125  
-65 to +150  
+300  
°C  
°C  
°C  
°C  
°C  
SA556  
SE556  
T
STG  
Storage temperature range  
Lead soldering temperature (10sec max)  
T
SOLD  
NOTES:  
1. The junction temperature must be kept below 125°C for the D package and below 150°C for the N and F packages. At ambient temperatures  
above 25°C, where this limit would be exceeded, the Maximum Allowable Power Dissipation must be derated by the following:  
D package 115°C/W  
N package 80°C/W  
F package 100°C/W  
354  
August 31, 1994  

与NE556N相关器件

型号 品牌 描述 获取价格 数据表
NE556N/P3 TI IC,TIMER,BIPOLAR,DIP,14PIN,PLASTIC

获取价格

NE556N3 TI IC,TIMER,BIPOLAR,DIP,14PIN,PLASTIC

获取价格

NE556N-B PHILIPS Analog Waveform Generation Function, BIPolar, PDIP14

获取价格

NE556NE4 TI DUAL PRECISION TIMERS

获取价格

NE556NR TI PULSE; RECTANGULAR, TIMER, PDIP14, ROHS COMPLIANT, PLASTIC, DIP-14

获取价格

NE556NSIIA PHILIPS Analog Waveform Generation Function, BIPolar, PDIP14

获取价格