Spec. No. : C022N8J
Issued Date : 2018.03.07
Revised Date :
CYStech Electronics Corp.
age No. : 13/13
2928-8J Dimension
Marking:
D1 D1 D2 D2
4303
Date
Code
S1 G1 S2 G2
8-Lead 2928-8J Plastic Package
CYStek Package Code: N8J
Millimeters
DIM
Inches
Millimeters
Inches
DIM
Min.
Max.
Min.
Max.
Min.
2.300
2.650
Max.
2.500
3.050
Min.
Max.
A
A1
A2
b
0.935
0.010
0.925
0.250
0.100
2.950
2.500
1.100
0.100
1.000
0.400
0.200
3.100
3.000
0.0368
0.0004
0.0364
0.0098
0.0433
0.0039
0.0394
0.0157
E1
E2
e
L
θ
0.0906
0.1043
0.0984
0.1201
0.65 BSC
0.0256 BSC
0.300
0.600
0.0118
0.0236
0°
8°
0°
8°
c
D
E
0.0039
0.1161
0.0984
0.0079
0.1220
0.1181
7° TYP
7° TYP
θ1
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTC4303N8J
CYStek Product Specification