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MT8976AE1 PDF预览

MT8976AE1

更新时间: 2024-01-29 18:00:54
品牌 Logo 应用领域
美高森美 - MICROSEMI 电信光电二极管电信集成电路
页数 文件大小 规格书
36页 475K
描述
DATACOM, FRAMER, PDIP28, LEAD FREE, PLASTIC, MS-011AB, DIP-28

MT8976AE1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:28
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.25JESD-30 代码:R-PDIP-T28
JESD-609代码:e3长度:37.4 mm
功能数量:1端子数量:28
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:6.35 mm标称供电电压:5 V
表面贴装:NO电信集成电路类型:FRAMER
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15.24 mmBase Number Matches:1

MT8976AE1 数据手册

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