Datasheet > MSM7557

MSM7557

更新时间： 2022-12-12 11:17:16

品牌	Logo	应用领域
冲电气 - OKI		调制解调器电话
页数	文件大小	规格书
25页	152K
描述
Single Chip MSK Modem with Compandor for Cordless Telephone

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MSM7557 数据手册

¡ Semiconductor

MSM7557

PACKAGE DIMENSIONS

(Unit : mm)

QFP56-P-910-0.65-2K

Mirror finish

Package material

Lead frame material

Pin treatment

Solder plate thickness

Package weight (g)

Epoxy resin

42 alloy

Solder plating

5 mm or more

0.43 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which

are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

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型号	品牌	描述	获取价格	数据表
MSM7557GS-2K	OKI	Modem, 2.4kbps Data, PQFP56, 9 X 10 MM, 0.65 MM PITCH, PLASTIC, QFP-56	获取价格
MSM7560	OKI	Single Rail ADPCM CODEC	获取价格
MSM7560GS-K	OKI	ADPCM Codec, MU-Law, 1-Func, PDSO28, PLASTIC, SOP-28	获取价格
MSM7560L	OKI	Single Rail ADPCM CODEC	获取价格
MSM7560LGS-K	OKI	ADPCM Codec, MU-Law, 1-Func, PDSO28, PLASTIC, SOP-28	获取价格
MSM7560LTS-K	OKI	暂无描述	获取价格