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MSM7544 PDF预览

MSM7544

更新时间: 2024-02-01 02:41:14
品牌 Logo 应用领域
冲电气 - OKI /
页数 文件大小 规格书
19页 160K
描述
Single Rail CODEC

MSM7544 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSSOP, TSSOP20/26,.36Reach Compliance Code:unknown
风险等级:5.92压伸定律:A-LAW
滤波器:YES最大增益公差:1.2 dB
JESD-30 代码:R-PDSO-G20JESD-609代码:e0
线性编码:NOT AVAILABLE功能数量:1
端子数量:20最高工作温度:85 °C
最低工作温度:-30 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP20/26,.36
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
电源:5 V认证状态:Not Qualified
子类别:Codecs最大压摆率:6 mA
标称供电电压:5 V表面贴装:YES
技术:CMOS电信集成电路类型:PCM CODEC
温度等级:OTHER端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUALBase Number Matches:1

MSM7544 数据手册

 浏览型号MSM7544的Datasheet PDF文件第13页浏览型号MSM7544的Datasheet PDF文件第14页浏览型号MSM7544的Datasheet PDF文件第15页浏览型号MSM7544的Datasheet PDF文件第16页浏览型号MSM7544的Datasheet PDF文件第17页浏览型号MSM7544的Datasheet PDF文件第18页 
¡ Semiconductor  
MSM7543/7544  
(Unit : mm)  
TSOPII26/20-P-300-1.27-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
0.38 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
19/19  

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