Datasheet > MPX2300DT1

MPX2300DT1

更新时间： 2024-01-28 01:28:38

品牌	Logo	应用领域
飞思卡尔 - FREESCALE		传感器换能器压力传感器
页数	文件大小	规格书
4页	96K
描述
High Volume Pressure Sensor For Disposable Applications

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技术参数
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MPX2300DT1 技术参数

生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.76	最大精度 (%)：	3%
主体宽度：	3.68 mm	主体高度：	9.14 mm
主体长度或直径：	6.35 mm	JESD-609代码：	e0
线性度 (%)：	1.5 %	安装特点：	THROUGH HOLE MOUNT
标称偏移：	0MV	最大工作电流：	1 mA
最高工作温度：	40 °C	最低工作温度：	15 °C
输出范围：	0-3mV	输出类型：	ANALOG VOLTAGE
封装形状/形式：	RECTANGULAR	最大压力范围：	5.8 Psi
最小压力范围：		压力传感模式：	DIFFERENTIAL
响应时间：	1000 µs	灵敏度（mV / V）：	5 mV/V
传感器/换能器类型：	PRESSURE SENSOR,PEIZORESISTIVE	最大供电电压：	10 V
最小供电电压：	6 V	表面贴装：	NO
端子面层：	Tin/Lead (Sn/Pb)	端接类型：	SOLDER
Base Number Matches：	1

MPX2300DT1 数据手册

MPX2300DT1

Rev. 6, 10/2004

Freescale Semiconductor

Technical Data

High Volume Pressure Sensor

For Disposable Applications

Freescale Semiconductor has developed a low cost, high volume, miniature pressure

sensor package which is ideal as a sub--module component or a disposable unit. The

unique concept of the Chip Pak allows great flexibility in system design while allowing an

economic solution for the designer. This new chip carrier package uses Freescale

Semiconductor’s unique sensor die with its piezoresistive technology, along with the

added feature of on--chip, thin--film temperature compensation and calibration.

NOTE: Freescale Semiconductor is also offering the Chip Pak package in

application--specific configurations, which will have an “SPX” prefix, followed by a

four--digit number, unique to the specific customer.

MPX2300DT1

MPX2301DT1

Freescale Semiconductor Preferred Device

PRESSURE SENSORS

0 to 300 mmHg (0 to 40 kPa)

Features

•

Low Cost

CHIP PAK PACKAGE

Integrated Temperature Compensation and Calibration

Ratiometric to Supply Voltage

Polysulfone Case Material (Medical, Class V Approved)

Provided in Easy--to--Use Tape and Reel

Application Examples

MPX2300/1DT1

CASE 423A

•

Medical Diagnostics

Infusion Pumps

Blood Pressure Monitors

Pressure Catheter Applications

Patient Monitoring

PIN NUMBER

S--

S+

Gnd

NOTE: The die and wire bonds are exposed on the front side of the Chip Pak

(pressure is applied to the backside of the device). Front side die and wire protection

must be provided in the customer’s housing. Use caution when handling the devices

during all processes.

Freescale

Semiconductor’s

MPX2300DT1/

A silicone dielectric gel covers the silicon piezoresistive

sensing element. The gel is a nontoxic, nonallergenic elasto-

mer system which meets all USP XX Biological Testing Class

V requirements. The properties of the gel allow it to transmit

pressure uniformly to the diaphragm surface, while isolating

the internal electrical connections from the corrosive effects

of fluids, such as saline solution. The gel provides electrical

isolation sufficient to withstand defibrillation testing, as speci-

fied in the proposed Association for the Advancement of

Medical Instrumentation (AAMI) Standard for blood pressure

transducers. A biomedically approved opaque filler in the gel

prevents bright operating room lights from affecting the per-

formance of the sensor. The MPX2301DT1 is a reduced gel

option.

MPX2301DT1 Pressure Sensors have been designed for

medical usage by combining the performance of Freescale

Semiconductor’s shear stress pressure sensor design and

the use of biomedically approved materials. Materials with a

proven history in medical situations have been chosen to

provide a sensor that can be used with confidence in

applications, such as invasive blood pressure monitoring. It

can be sterilized using ethylene oxide. The portions of the

pressure sensor that are required to be biomedically

approved are the rigid housing and the gel coating.

The rigid housing is molded from a white, medical grade

polysulfone that has passed extensive biological testing

including: tissue culture test, rabbit implant, hemolysis,

intracutaneous test in rabbits, and system toxicity, USP.

Preferred devices are Freescale Semiconductor recommended choices for future use and best overall value.

Sensor Device Data

Freescale Semiconductor

12 3 4

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MPX2300DT1_12	FREESCALE	High Volume Pressure Sensor for Disposable Applications	获取价格
MPX2301D	NXP	CHIP PAK	获取价格
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