是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | BGA, BGA483,22X22,50 | Reach Compliance Code: | unknown |
风险等级: | 5.8 | 位大小: | 32 |
JESD-30 代码: | S-XBGA-B483 | 端子数量: | 483 |
最高工作温度: | 105 °C | 最低工作温度: | |
封装主体材料: | CERAMIC | 封装代码: | BGA |
封装等效代码: | BGA483,22X22,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 电源: | 1.3,1.5/2.5,1.8/2.5 V |
认证状态: | Not Qualified | 速度: | 867 MHz |
子类别: | Microprocessors | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MPC745BPX300 | NXP | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTI |
获取价格 |
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MPC745BPX300TD | MOTOROLA | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, PLASTIC, BGA-255 |
获取价格 |
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MPC745BPX350RD | MOTOROLA | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA255, PLASTIC, BGA-255 |
获取价格 |
|
MPC745BVT300 | NXP | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, LEAD F |
获取价格 |
|
MPC745BVT300LE | NXP | GF REV2.8,105C ,PB FREE |
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MPC745BZT300LD | MOTOROLA | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, PLASTIC, BGA-255 |
获取价格 |