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ML22594 PDF预览

ML22594

更新时间: 2024-01-21 08:53:45
品牌 Logo 应用领域
罗姆 - ROHM 存储
页数 文件大小 规格书
78页 3432K
描述
存储器外挂型

ML22594 技术参数

生命周期:ActiveReach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.7
商用集成电路类型:SPEECH SYNTHESIZERJESD-30 代码:R-PDSO-G30
端子数量:30最高工作温度:105 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP30,.3
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
电源:5 V认证状态:Not Qualified
子类别:Audio Synthesizer ICs表面贴装:YES
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.635 mm端子位置:DUAL
Base Number Matches:1

ML22594 数据手册

 浏览型号ML22594的Datasheet PDF文件第2页浏览型号ML22594的Datasheet PDF文件第3页浏览型号ML22594的Datasheet PDF文件第4页浏览型号ML22594的Datasheet PDF文件第5页浏览型号ML22594的Datasheet PDF文件第6页浏览型号ML22594的Datasheet PDF文件第7页 
Dear customer  
LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1st day of October,  
2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which  
LAPIS established a new company, LAPIS Technology Co., Ltd. (“LAPIS  
Technology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business.  
Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"  
and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."  
Furthermore, there are no changes to the documents relating to our products other than  
the company name, the company trademark, logo, etc.  
Thank you for your understanding.  
LAPIS Technology Co., Ltd.  
October 1, 2020  

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