Datasheet > MKL26Z32VFM4

MKL26Z32VFM4

更新时间： 2024-01-05 12:23:43

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
61页	1370K
描述
Kinetis KL26 Sub-Family

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MKL26Z32VFM4 数据手册

Ratings

1 Ratings

1.1 Thermal handling ratings

Table 1. Thermal handling ratings

Symbol

T_STG

Description

Min.

–55

—

Max.

150

Unit

°C

Notes

Storage temperature

Solder temperature, lead-free

T_SDR

260

°C

1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.

2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

1.2 Moisture handling ratings

Table 2. Moisture handling ratings

Symbol

Description

Min.

Max.

Unit

Notes

MSL

Moisture sensitivity level

—

1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

1.3 ESD handling ratings

Table 3. ESD handling ratings

Symbol

V_HBM

Description

Min.

–2000

–500

Max.

+2000

+500

Unit

Notes

Electrostatic discharge voltage, human body model

V_CDM

Electrostatic discharge voltage, charged-device

model

I_LAT

Latch-up current at ambient temperature of 105 °C

–100

+100

1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human

Body Model (HBM).

2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for

Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.

3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test.

Kinetis KL26 Sub-Family, Rev5 08/2014.

Freescale Semiconductor, Inc.

1 2 345 6 7...61

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