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MK70FX512VMJ12 PDF预览

MK70FX512VMJ12

更新时间: 2024-01-14 14:13:49
品牌 Logo 应用领域
飞思卡尔 - FREESCALE /
页数 文件大小 规格书
92页 1299K
描述
K70 Sub-Family Data Sheet

MK70FX512VMJ12 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:LBGA,针数:256
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.75
具有ADC:YES地址总线宽度:
位大小:32最大时钟频率:32 MHz
DAC 通道:YESDMA 通道:YES
外部数据总线宽度:JESD-30 代码:S-PBGA-B256
长度:17 mm端子数量:256
最高工作温度:105 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILEROM可编程性:FLASH
座面最大高度:1.7 mm速度:120 MHz
最大供电电压:3.6 V最小供电电压:1.71 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM宽度:17 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

MK70FX512VMJ12 数据手册

 浏览型号MK70FX512VMJ12的Datasheet PDF文件第2页浏览型号MK70FX512VMJ12的Datasheet PDF文件第3页浏览型号MK70FX512VMJ12的Datasheet PDF文件第4页浏览型号MK70FX512VMJ12的Datasheet PDF文件第5页浏览型号MK70FX512VMJ12的Datasheet PDF文件第6页浏览型号MK70FX512VMJ12的Datasheet PDF文件第7页 
Document Number: K70P256M120SF3  
Rev. 3, 2/2012  
Freescale Semiconductor  
Data Sheet: Advance Information  
K70P256M120SF3  
K70 Sub-Family Data Sheet  
Supports the following:  
MK70FX512VMJ12,  
MK70FN1M0VMJ12  
Features  
Security and integrity modules  
– Hardware CRC module to support fast cyclic  
redundancy checks  
Operating Characteristics  
– Voltage range: 1.71 to 3.6 V  
– Flash write voltage range: 1.71 to 3.6 V  
– Temperature range (ambient): -40 to 105°C  
– Tamper detect and secure storage  
– Hardware random-number generator  
– Hardware encryption supporting DES, 3DES, AES,  
MD5, SHA-1, and SHA-256 algorithms  
– 128-bit unique identification (ID) number per chip  
Performance  
– Up to 120 MHz ARM Cortex-M4 core with DSP  
instructions delivering 1.25 Dhrystone MIPS per  
MHz  
Human-machine interface  
– Graphic LCD controller  
– Low-power hardware touch sensor interface (TSI)  
– General-purpose input/output  
Memories and memory interfaces  
– Up to 1024 KB program flash memory on non-  
FlexMemory devices  
– Up to 512 KB program flash memory on  
FlexMemory devices  
Analog modules  
– Four 16-bit SAR ADCs  
– Up to 512 KB FlexNVM on FlexMemory devices  
– 16 KB FlexRAM on FlexMemory devices  
– Up to 128 KB RAM  
– Programmable gain amplifier (PGA) (up to x64)  
integrated into each ADC  
– Two 12-bit DACs  
– Serial programming interface (EzPort)  
– FlexBus external bus interface  
– DDR controller interface  
– Four analog comparators (CMP) containing a 6-bit  
DAC and programmable reference input  
– Voltage reference  
– NAND flash controller interface  
Timers  
Clocks  
– Programmable delay block  
– Two 8-channel motor control/general purpose/PWM  
timers  
– Two 2-channel quadrature decoder/general purpose  
timers  
– 3 to 32 MHz crystal oscillator  
– 32 kHz crystal oscillator  
– Multi-purpose clock generator  
System peripherals  
– IEEE 1588 timers  
– 10 low-power modes to provide power optimization  
based on application requirements  
– Memory protection unit with multi-master  
protection  
– 32-channel DMA controller, supporting up to 128  
request sources  
– Periodic interrupt timers  
– 16-bit low-power timer  
– Carrier modulator transmitter  
– Real-time clock  
– External watchdog monitor  
– Software watchdog  
– Low-leakage wakeup unit  
This document contains information on a new product. Specifications and  
information herein are subject to change without notice.  
© 2012 Freescale Semiconductor, Inc.  
Preliminary  

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