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MCP23S09TEP PDF预览

MCP23S09TEP

更新时间: 2024-02-02 09:10:27
品牌 Logo 应用领域
美国微芯 - MICROCHIP /
页数 文件大小 规格书
50页 605K
描述
8-Bit I/O Expander with Open-Drain Outputs

MCP23S09TEP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SSOP
包装说明:5.30 MM, LEAD FREE, PLASTIC, SSOP-20针数:20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.51
JESD-30 代码:R-PDSO-G20JESD-609代码:e3
长度:7.2 mm湿度敏感等级:1
I/O 线路数量:8端口数量:1
端子数量:20最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:2 mm
最大供电电压:5.5 V最小供电电压:1.8 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:MATTE TIN (SN)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:5.3 mm
uPs/uCs/外围集成电路类型:PARALLEL IO PORT, GENERAL PURPOSE

MCP23S09TEP 数据手册

 浏览型号MCP23S09TEP的Datasheet PDF文件第4页浏览型号MCP23S09TEP的Datasheet PDF文件第5页浏览型号MCP23S09TEP的Datasheet PDF文件第6页浏览型号MCP23S09TEP的Datasheet PDF文件第8页浏览型号MCP23S09TEP的Datasheet PDF文件第9页浏览型号MCP23S09TEP的Datasheet PDF文件第10页 
MCP23009/MCP23S09  
1.3.3  
SPI INTERFACE  
1.3.3.2  
SPI Read Operation  
The MCP23S09 operates in Mode 0,0 and Mode 1,1.  
The difference between the two modes is the idle state  
of the clock.  
The SPI read operation is started by lowering CS. The  
SPI read command (slave address with R/W bit set) is  
then clocked into the device. The opcode is followed by  
an address, with at least one data byte being clocked  
out of the device.  
Mode 0,0: The idle state of the clock is LOW. Input data  
is latched on the rising edge of the clock; output data is  
driven on the falling edge of the clock.  
1.3.3.3  
SPI Sequential Write/Read  
Mode 1,1: The idle state of the clock is HIGH. Input  
data is latched on the rising edge of the clock; output  
data is driven on the falling edge of the clock.  
For sequential operations, instead of deselecting the  
device by raising CS, the master clocks the next byte  
pointed to by the address pointer. (see Section 1.3.1  
“Byte Mode and Sequential Mode” for details  
regarding sequential operation control).  
1.3.3.1  
SPI Write Operation  
The SPI write operation is started by lowering CS. The  
write command (slave address with R/W bit cleared) is  
then clocked into the device. The opcode is followed by  
an address and at least one data byte.  
The sequence ends by the raising of CS.  
The MCP23S09 address pointer will roll over to  
address zero after reaching the last register address.  
© 2009 Microchip Technology Inc.  
DS22121B-page 7  

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