MB205L
VOLTAGE 600 V
2 Amp
Elektronische Bauelemente
Miniature SMD Glass Passivated Bridge Rectifiers
RoHS compliant product
A suffix of “-C” specifies halogen & lead-free
Case: MBCR
FEATURES
Halogen-free type
A
Internal structure with GPRC (Glass Passivated Rectifier Chip) inside
Lead free product, compliance to RoHS
Lead less chip form, no lead damage
Lead-free solder joint, no wire bond & lead frame
Low power loss, high efficiency
High current capability
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
E
~
B
~
G
D
F
C
Millimeter
Millimeter
REF.
REF.
Min.
Max.
5.40
5.90
1.30
3.35
Min.
1.00
0.85
Max.
1.20
0.95
APPLICATION
AC/DC Power Supply
Communication Equipment
A
B
C
D
5.20
5.70
1.10
3.25
E
F
G
R 0.2 REF.
MECHANICAL DATA
MARKING
Case : Packed with FRP substrate and epoxy under-filled
Terminals : Pure Tin plated (Lead-Free),
solderable per MIL-STD-750, Method 2026
Polarity: Laser Marking Symbols
Weight: 0.07 grams
ABSOLUTE MAXIMUM RATINGS
(at TA=25℃unless otherwise specified)
SYMBOL
PARAMETERS
RATING
UNIT
Repetitive peak reverse voltage
VRRM
600
2.0
V
A
Average Forward Current
IF(AV)
Peak forward surge current,
IFSM
60
A
8.3ms single half sine-wave
Operating and Storage temperature range
TJ, TSTG
-55 ~ 175
℃
ELECTRICAL CHARACTERISTICS (at TA=25℃unless otherwise specified)
SYMBOL
PARAMETERS
Min.
Typ.
Max.
UNIT
Forward Voltage at IF = 2.0A
VF
-
0.92
0.95
5
V
Repetitive peak reverse current
VR = Max. VRRM
IRRM
-
0.08
uA
Current squared time t < 8.3ms
I2t
CJ
-
-
-
-
14.9
35
60
3
-
-
-
-
A2s
pF
Junction Capacitance, VR = 4V, f =1.0MHz
Thermal Resistance Junction to Ambient 1
Thermal Resistance Junction to Lead 2
RθJA
RθJL
℃/W
Note: 1. Thermal resistance, junction to ambient, measured on PC board with 5.0 x 5.0mm (0.03mm thick) land areas.
2. The thermal resistance in measured over the centered point of the copper pad.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
03-Sep-2010 Rev. A
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