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MB205L PDF预览

MB205L

更新时间: 2024-01-18 21:24:00
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描述
Miniature SMD Glass Passivated Bridge Rectifiers

MB205L 数据手册

 浏览型号MB205L的Datasheet PDF文件第2页 
MB205L  
VOLTAGE 600 V  
2 Amp  
Elektronische Bauelemente  
Miniature SMD Glass Passivated Bridge Rectifiers  
RoHS compliant product  
A suffix of “-C” specifies halogen & lead-free  
Case: MBCR  
FEATURES  
Halogen-free type  
A
Internal structure with GPRC (Glass Passivated Rectifier Chip) inside  
Lead free product, compliance to RoHS  
Lead less chip form, no lead damage  
Lead-free solder joint, no wire bond & lead frame  
Low power loss, high efficiency  
High current capability  
Plastic package has Underwriters Laboratory Flammability  
Classification 94V-0  
E
~
B
~
G
D
F
C
Millimeter  
Millimeter  
REF.  
REF.  
Min.  
Max.  
5.40  
5.90  
1.30  
3.35  
Min.  
1.00  
0.85  
Max.  
1.20  
0.95  
APPLICATION  
AC/DC Power Supply  
Communication Equipment  
A
B
C
D
5.20  
5.70  
1.10  
3.25  
E
F
G
R 0.2 REF.  
MECHANICAL DATA  
MARKING  
Case : Packed with FRP substrate and epoxy under-filled  
Terminals : Pure Tin plated (Lead-Free),  
solderable per MIL-STD-750, Method 2026  
Polarity: Laser Marking Symbols  
Weight: 0.07 grams  
ABSOLUTE MAXIMUM RATINGS  
(at TA=25unless otherwise specified)  
SYMBOL  
PARAMETERS  
RATING  
UNIT  
Repetitive peak reverse voltage  
VRRM  
600  
2.0  
V
A
Average Forward Current  
IF(AV)  
Peak forward surge current,  
IFSM  
60  
A
8.3ms single half sine-wave  
Operating and Storage temperature range  
TJ, TSTG  
-55 ~ 175  
ELECTRICAL CHARACTERISTICS (at TA=25unless otherwise specified)  
SYMBOL  
PARAMETERS  
Min.  
Typ.  
Max.  
UNIT  
Forward Voltage at IF = 2.0A  
VF  
-
0.92  
0.95  
5
V
Repetitive peak reverse current  
VR = Max. VRRM  
IRRM  
-
0.08  
uA  
Current squared time t < 8.3ms  
I2t  
CJ  
-
-
-
-
14.9  
35  
60  
3
-
-
-
-
A2s  
pF  
Junction Capacitance, VR = 4V, f =1.0MHz  
Thermal Resistance Junction to Ambient 1  
Thermal Resistance Junction to Lead 2  
RθJA  
RθJL  
/W  
Note: 1. Thermal resistance, junction to ambient, measured on PC board with 5.0 x 5.0mm (0.03mm thick) land areas.  
2. The thermal resistance in measured over the centered point of the copper pad.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
03-Sep-2010 Rev. A  
Page 1 of 2  

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