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MAX986EXK+

更新时间： 2024-01-28 22:44:30
品牌 Logo 应用领域
美信 - MAXIM 放大器光电二极管
页数 文件大小 规格书
13页 447K
描述
Comparator, 1 Func, 7000uV Offset-Max, PDSO5, SC-70, 5 PIN

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中文翻译

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MAX986EXK+ 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：TSSOP,
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.74
放大器类型：COMPARATOR最大平均偏置电流 (IIB)：0.01 µA
最大输入失调电压：7000 µVJESD-30 代码：R-PDSO-G5
JESD-609代码：e3长度：2 mm
湿度敏感等级：1功能数量：1
端子数量：5最高工作温度：85 °C
最低工作温度：-40 °C输出类型：OPEN-DRAIN
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED座面最大高度：1.1 mm
子类别：Comparator供电电压上限：6 V
标称供电电压 (Vsup)：5 V表面贴装：YES
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：1.25 mmBase Number Matches：1

MAX986EXK+ 数据手册

 浏览型号MAX986EXK+的Datasheet PDF文件第6页浏览型号MAX986EXK+的Datasheet PDF文件第7页浏览型号MAX986EXK+的Datasheet PDF文件第8页浏览型号MAX986EXK+的Datasheet PDF文件第10页浏览型号MAX986EXK+的Datasheet PDF文件第11页浏览型号MAX986EXK+的Datasheet PDF文件第12页 
Micropower, Low-Voltage, UCSP/SC70,  
Rail-to-Rail I/O Comparators  
Zero-Crossing Detector  
UCSP Reliability  
Figure 3 shows a zero-crossing detector application.  
The chip-scale package (UCSP) represents a unique  
packaging form factor that may not perform equally to a  
packaged product through traditional mechanical relia-  
bility tests. UCSP reliability is integrally linked to the  
user’s assembly methods, circuit board material, and  
usage environment. The user should closely review  
these areas when considering use of a UCSP package.  
Performance through Operating Life Test and Moisture  
Resistance remains uncompromised as it is primarily  
determined by the wafer-fabrication process.  
The MAX985’s inverting input is connected to ground,  
and its noninverting input is connected to a 100mV  
P-P  
signal source. As the signal at the noninverting input  
crosses 0V, the comparator’s output changes state.  
Logic-Level Translator  
Figure 4 shows an application that converts 5V logic lev-  
els to 3V logic levels. The MAX986 is powered by the 5V  
supply voltage, and the pullup resistor for the MAX986’s  
open-drain output is connected to the 3V supply voltage.  
This configuration allows the full 5V logic swing without  
creating overvoltage on the 3V logic inputs. For 3V to 5V  
logic-level translation, simply connect the 3V supply to  
Mechanical stress performance is a greater consideration  
for a UCSP package. UCSPs are attached through direct  
solder contact to the user’s PC board, foregoing the  
inherent stress relief of a packaged product lead frame.  
Solder joint contact integrity must be considered.  
Information on Maxim’s qualification plan, test data, and  
recommendations are detailed in the UCSP application  
note, which can be found on Maxim’s website at  
www.maxim-ic.com.  
V
CC  
and the 5V supply to the pullup resistor.  
UCSP Package Consideration  
For general UCSP package information and PC layout  
considerations, please refer to Maxim Application  
Note,“Wafer-Level Chip-Scale Package.”  
5V (3V)  
V
V
CC  
3V (5V)  
2
2
100kΩ  
V
CC  
R
CC  
PULLUP  
100mV  
4
3
IN-  
IN+  
4
3
IN+  
IN-  
3V (5V)  
LOGIC OUT  
1
OUT  
1
OUT  
100kΩ  
MAX986  
MAX985  
V
EE  
V
EE  
5
5
5V (3V) LOGIC IN  
Figure 3. Zero-Crossing Detector  
Figure 4. Logic-Level Translator  
_______________________________________________________________________________________  
9
1...678910111213

中文翻译

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