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MAX9779ETI+T

更新时间: 2024-02-01 06:00:25
品牌 Logo 应用领域
美信 - MAXIM 放大器信息通信管理商用集成电路
页数 文件大小 规格书
19页 420K
描述
Audio Amplifier, 2.6W, 2 Channel(s), 1 Func, BICMOS, 5 X 5 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WHHD-1, TQFN-28

MAX9779ETI+T 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFN包装说明:HVQCCN, LCC28,.2SQ,20
针数:28Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.33.00.01
风险等级:5.82标称带宽:22 kHz
商用集成电路类型:AUDIO AMPLIFIER增益:19.5 dB
JESD-30 代码:S-XQCC-N28JESD-609代码:e3
长度:5 mm湿度敏感等级:1
信道数量:2功能数量:1
端子数量:28最高工作温度:85 °C
最低工作温度:-40 °C标称输出功率:2.6 W
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC28,.2SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:5 V认证状态:Not Qualified
座面最大高度:0.8 mm子类别:Audio/Video Amplifiers
最大压摆率:29 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:5 mm
Base Number Matches:1

MAX9779ETI+T 数据手册

 浏览型号MAX9779ETI+T的Datasheet PDF文件第12页浏览型号MAX9779ETI+T的Datasheet PDF文件第13页浏览型号MAX9779ETI+T的Datasheet PDF文件第14页浏览型号MAX9779ETI+T的Datasheet PDF文件第16页浏览型号MAX9779ETI+T的Datasheet PDF文件第17页浏览型号MAX9779ETI+T的Datasheet PDF文件第18页 
2.6W Stereo Audio Power Amplifier and  
DirectDrive Headphone Amplifier  
Table 2. Suggested Capacitor Manufacturers  
SUPPLIER  
Taiyo Yuden  
TDK  
PHONE  
FAX  
WEBSITE  
8±±-ꢀ48-ꢁ496  
8±7-8±ꢀ-61±±  
847-9ꢁ5-±899  
847-ꢀ9±-44±5  
www.t-yuden.com  
www.component.tdk.com  
BIAS Capacitor  
BIAS is the output of the internally generated DC bias  
voltage. The BIAS bypass capacitor, C , improves  
transients. Bypass CPV with Cꢀ, the same value as C1,  
DD  
and place it physically close to CPV  
and PGND (refer  
DD  
to the MAX9779 Evaluation Kit for a suggested layout).  
BIAS  
PSRR and THD+N by reducing power supply and other  
noise sources at the common-mode bias node, and  
also generates the clickless/popless, startup/shutdown  
DC bias waveforms for the speaker amplifiers. Bypass  
BIAS with a 1µF capacitor to GND.  
Powering Other Circuits from a  
Negative Supply  
An additional benefit of the MAX9779 is the internally gen-  
erated negative supply voltage (CPV ). CPV is used  
SS  
SS  
by the MAX9779 to provide the negative supply for the  
headphone amplifiers. It can also be used to power other  
Charge-Pump Capacitor Selection  
Use capacitors with an ESR less than 1±±mfor opti-  
mum performance. Low-ESR ceramic capacitors mini-  
mize the output resistance of the charge pump. For  
best performance over the extended temperature  
range, select capacitors with an X7R dielectric. Table 4  
lists suggested manufacturers.  
devices within a design. Current draw from CPV should  
SS  
be limited to 5mA; exceeding this affects the operation of  
the headphone amplifier. A typical application is a nega-  
tive supply to adjust the contrast of LCD modules.  
When considering the use of CPV  
in this manner,  
SS  
note that the charge-pump voltage of CPV is roughly  
SS  
proportional to CPV  
and is not a regulated voltage.  
DD  
Flying Capacitor (C1)  
The value of the flying capacitor (C1) affects the load  
regulation and output resistance of the charge pump. A  
C1 value that is too small degrades the device’s ability  
to provide sufficient current drive, which leads to a loss  
of output voltage. Increasing the value of C1 improves  
load regulation and reduces the charge-pump output  
resistance to an extent. See the Output Power vs.  
Charge-Pump Capacitance and Load Resistance  
graph in the Typical Operating Characteristics. Above  
ꢁ.ꢁµF, the on-resistance of the switches and the ESR of  
C1 and Cꢁ dominate.  
The charge-pump output impedance plot appears in  
the Typical Operating Characteristics.  
Layout and Grounding  
Proper layout and grounding are essential for optimum  
performance. Use large traces for the power-supply  
inputs and amplifier outputs to minimize losses due to  
parasitic trace resistance, as well as route head away  
from the device. Good grounding improves audio per-  
formance, minimizes crosstalk between channels, and  
prevents any switching noise from coupling into the audio  
signal. Connect CPGND, PGND, and GND together at a  
single point on the PC board. Route CPGND and all traces  
that carry switching transients away from GND, PGND,  
and the traces and components in the audio signal path.  
Output Capacitor (C2)  
The output capacitor value and ESR directly affect the  
ripple at CPV . Increasing the value of Cꢁ reduces  
SS  
output ripple. Likewise, decreasing the ESR of Cꢁ  
reduces both ripple and output resistance. Lower  
capacitance values can be used in systems with low  
maximum output power levels. See the Output Power  
vs. Charge-Pump Capacitance and Load Resistance  
graph in the Typical Operating Characteristics.  
Connect all components associated with the charge  
pump (Cꢁ and Cꢀ) to the CPGND plane. Connect V  
SS  
and CPV  
together at the device. Place the charge-  
SS  
pump capacitors (C1, Cꢁ, and Cꢀ) as close to the  
device as possible. Bypass HPV and PV with a  
DD  
DD  
±.1µF capacitor to GND. Place the bypass capacitors  
as close to the device as possible.  
CPV  
Bypass Capacitor  
DD  
Use large, low-resistance output traces. As load imped-  
ance decreases, the current drawn from the device out-  
puts increase. At higher current, the resistance of the  
output traces decrease the power delivered to the load.  
The CPV  
bypass capacitor (Cꢀ) lowers the output  
DD  
impedance of the power supply and reduces the  
impact of the MAX9779’s charge-pump switching  
______________________________________________________________________________________ 15  

MAX9779ETI+T 替代型号

型号 品牌 替代类型 描述 数据表
TPA6047A4RHBR TI

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