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MAX3877EVKIT PDF预览

MAX3877EVKIT

更新时间: 2024-01-10 04:06:15
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
6页 246K
描述
Evaluation Kits for the MAX3877/MAX3878

MAX3877EVKIT 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:QFP
包装说明:TFQFP,针数:32
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.81Is Samacsys:N
JESD-30 代码:S-PQFP-G32JESD-609代码:e3
长度:5 mm湿度敏感等级:1
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TFQFP
封装形状:SQUARE封装形式:FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.2 mm标称供电电压:3.3 V
表面贴装:YES技术:BIPOLAR
电信集成电路类型:ATM/SONET/SDH CLOCK RECOVERY CIRCUIT温度等级:INDUSTRIAL
端子面层:TIN端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:5 mm
Base Number Matches:1

MAX3877EVKIT 数据手册

 浏览型号MAX3877EVKIT的Datasheet PDF文件第1页浏览型号MAX3877EVKIT的Datasheet PDF文件第2页浏览型号MAX3877EVKIT的Datasheet PDF文件第3页浏览型号MAX3877EVKIT的Datasheet PDF文件第4页浏览型号MAX3877EVKIT的Datasheet PDF文件第5页 
MAX3877/MAX3878 Evaluation Kits  
1.0"  
1.0"  
Figure 5. MAX3877/MAX3878 EV Kit PC Board Layout—  
Solder Side  
Figure 4. MAX3877/MAX3878 EV Kit PC Board Layout—  
Component Side  
1.0"  
1.0"  
Figure 7. MAX3877/MAX3878 EV Kit PC Board Layout—  
Ground Plane  
Figure 6. MAX3877/MAX3878 EV Kit PC Board Layout—  
Power Plane  
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
6 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600  
© 2001 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products.  

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