Datasheet > LQM21PN3R3MGE#

LQM21PN3R3MGE#

更新时间： 2023-09-03 20:28:15

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村田 - MURATA		/
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LQM21PN3R3MGE# 数据手册

Spec No.:JELF243B-0089-01

P6/10

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

12. Precautions for Use

This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a

conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for flow and reflow soldering:

1.2

3.0 to 4.0

1.0

(in mm)

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 150 μm

If you want to use a flux other than the above, please consult our technical department.

12.3 Soldering conditions (flow, reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

100°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

MURATA MFG CO., LTD

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