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LOC112P PDF预览

LOC112P

更新时间: 2024-02-03 03:49:35
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
6页 123K
描述
Linear Optocoupler

LOC112P 数据手册

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LOC112  
INTEGRATED  
CIRCUITS  
DIVISION  
Manufacturing Information  
Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to  
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according  
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
LOC112 / LOC112P / LOC112S  
MSL 1  
ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020  
must be observed.  
Device  
MaximumTemperature xTime  
LOC112 / LOC112S  
LOC112P  
250ºC for 30 seconds  
260ºC for 30 seconds  
Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as  
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary  
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.  
Cleaning methods that employ ultrasonic energy should not be used.  
Pb  
e3  
R05  
4
www.ixysic.com  

LOC112P 替代型号

型号 品牌 替代类型 描述 数据表
LOC111 IXYS

完全替代

Linear Optocoupler
LOC110 IXYS

完全替代

Single Linear Optocoupler
LOC110S IXYS

完全替代

Single Linear Optocoupler

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