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LNK306PN PDF预览

LNK306PN

更新时间: 2024-02-23 07:32:21
品牌 Logo 应用领域
帕沃英蒂格盛 - POWERINT 开关
页数 文件大小 规格书
20页 712K
描述
LinkSwitch-TN Family Lowest Component Count, Energy-Effi cient Off-Line Switcher IC

LNK306PN 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:8
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.6
模拟集成电路 - 其他类型:SWITCHING REGULATOR控制技术:PULSE WIDTH MODULATION
JESD-30 代码:R-PDIP-T8长度:9.575 mm
功能数量:1端子数量:8
最高工作温度:85 °C最低工作温度:-20 °C
最大输出电流:1.4 A封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
表面贴装:NO切换器配置:BUCK
最大切换频率:70 kHz温度等级:COMMERCIAL EXTENDED
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:6.35 mm
Base Number Matches:1

LNK306PN 数据手册

 浏览型号LNK306PN的Datasheet PDF文件第12页浏览型号LNK306PN的Datasheet PDF文件第13页浏览型号LNK306PN的Datasheet PDF文件第14页浏览型号LNK306PN的Datasheet PDF文件第16页浏览型号LNK306PN的Datasheet PDF文件第17页浏览型号LNK306PN的Datasheet PDF文件第18页 
LNK302/304-306  
DIP-8B  
D S .004 (.10)  
Notes:  
.137 (3.48)  
MINIMUM  
1. Package dimensions conform to JEDEC specification  
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)  
package with .300 inch row spacing.  
-E-  
2. Controlling dimensions are inches. Millimeter sizes are  
shown in parentheses.  
3. Dimensions shown do not include mold flash or other  
protrusions. Mold flash or protrusions shall not exceed  
.006 (.15) on any side.  
.240 (6.10)  
.260 (6.60)  
4. Pin locations start with Pin 1, and continue counter-clock-  
wise to Pin 8 when viewed from the top. The notch and/or  
dimple are aids in locating Pin 1. Pin 6 is omitted.  
5. Minimum metal to metal spacing at the package body for  
the omitted lead location is .137 inch (3.48 mm).  
6. Lead width measured at package body.  
Pin 1  
-D-  
.367 (9.32)  
.387 (9.83)  
7. Lead spacing measured with the leads constrained to be  
perpendicular to plane T.  
.057 (1.45)  
.068 (1.73)  
(NOTE 6)  
.125 (3.18)  
.145 (3.68)  
.015 (.38)  
MINIMUM  
-T-  
SEATING  
PLANE  
.008 (.20)  
.015 (.38)  
.120 (3.05)  
.140 (3.56)  
.300 (7.62) BSC  
(NOTE 7)  
.300 (7.62)  
.390 (9.91)  
.100 (2.54) BSC  
.048 (1.22)  
.053 (1.35)  
P08B  
.014 (.36)  
.022 (.56)  
T E D S .010 (.25) M  
PI-2551-121504  
SMD-8B  
D S .004 (.10)  
Notes:  
.137 (3.48)  
MINIMUM  
1. Controlling dimensions are  
inches. Millimeter sizes are  
shown in parentheses.  
-E-  
2. Dimensions shown do not  
include mold flash or other  
protrusions. Mold flash or  
protrusions shall not exceed  
.006 (.15) on any side.  
3. Pin locations start with Pin 1,  
and continue counter-clock-  
wise to Pin 8 when viewed  
from the top. Pin 6 is omitted.  
4. Minimum metal to metal  
spacing at the package body  
for the omitted lead location  
is .137 inch (3.48 mm).  
.372 (9.45)  
.388 (9.86)  
.240 (6.10)  
.260 (6.60)  
.420  
.010 (.25)  
E S  
.046 .060 .060 .046  
.080  
Pin 1  
Pin 1  
-D-  
.086  
.186  
.100 (2.54) (BSC)  
5. Lead width measured at  
package body.  
6. D and E are referenced  
datums on the package  
body.  
.286  
.367 (9.32)  
.387 (9.83)  
Solder Pad Dimensions  
.057 (1.45)  
.068 (1.73)  
(NOTE 5)  
.125 (3.18)  
.145 (3.68)  
.004 (.10)  
.032 (.81)  
.037 (.94)  
.048 (1.22)  
.053 (1.35)  
°
°
.009 (.23)  
0 - 8  
.036 (0.91)  
.044 (1.12)  
.004 (.10)  
.012 (.30)  
G08B  
PI-2546-121504  
15  
Rev. I 11/08  

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