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LMX5452SM/NOPB PDF预览

LMX5452SM/NOPB

更新时间: 2024-01-08 15:28:48
品牌 Logo 应用领域
德州仪器 - TI 电信电信集成电路
页数 文件大小 规格书
10页 835K
描述
Micro-Module Integrated Bluetooth 1.2 Baseband Controller and Radio 60-NFBGA -40 to 85

LMX5452SM/NOPB 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:LFBGA, BGA60,6X10,32
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.21JESD-30 代码:R-PBGA-B60
JESD-609代码:e1长度:9 mm
湿度敏感等级:4功能数量:1
端子数量:60最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA60,6X10,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:3/3.3 V
认证状态:Not Qualified座面最大高度:1.3 mm
子类别:Other Telecom ICs表面贴装:YES
技术:CMOS电信集成电路类型:TELECOM CIRCUIT
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6 mmBase Number Matches:1

LMX5452SM/NOPB 数据手册

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NRND  
LMX5452  
www.ti.com  
SNOSAU1A FEBRUARY 2006REVISED MARCH 2013  
Micro-Module Integrated Bluetooth® 1.2 Baseband Controller and Radio  
Check for Samples: LMX5452  
1
FEATURES  
INTERFACES  
23  
Compliant with the Bluetooth 1.2 Core  
Specification  
Full-duplex UART Supporting Transfer Rates  
up to 921.6 kbps Including Baud Rate  
Detection for HCI  
-80 dBm Receiver Sensitivity (Typical)  
Class 2 Operation  
Full Speed (12 Mbps) USB 2.0 for HCI  
ACCESS.bus and SPI/Microwire for Interfacing  
with External Non-volatile Memory  
Low Power Consumption:  
Advanced Power Management Features  
Advanced Audio Interface (AAI) for Interfacing  
with External 8-kHz PCM Codec  
Clocking Option 12/13 MHz with PLL  
Bypass Mode for Power Reduction  
Up to 3 GPIO port Pins (OP4/PG4, PG6, PG7)  
Controllable by HCI Commands  
High integration:  
Implemented in 0.18 μm CMOS Technology  
JTAG Based Serial On-chip Debug Interface  
Single Rx/Tx-pad Radio Interface  
RF Includes On-chip Antenna Filter and  
Switch  
On-chip Firmware with Complete HCI  
DESCRIPTION  
Embedded ROM and Patch RAM Memory  
The LMX5452 is a highly integrated Bluetooth 1.2  
compliant solution. The integrated baseband  
controller and 2.4 GHz radio combine to form a  
complete, small form-factor (6.1 mm × 9.1 mm × 1.2  
mm) Bluetooth node.  
Up to Seven Asynchronous Connection Less  
(ACL) Links  
Support for Two Simultaneous Voice or  
Synchronous Connection Oriented (SCO)  
Links  
The baseband controller has  
a standard Host  
Controller Interface (HCI). Based on the Texas  
Instruments CompactRISCTM 16-bit processor, the  
LMX5452 is optimized to handle the audio, data, and  
Accepts10-20 MHz External Clock or Crystal  
Network  
Fractional-N Sigma/Delta Modulator  
Operating Voltage Range 2.5–3.6V  
I/O Voltage Range 1.6–3.6V  
link management processing requirements of  
a
Bluetooth node.  
The on-chip memory, ROM, and Patch RAM provide  
lowest cost and minimize design risk with the  
flexibility of firmware upgrades.  
60-pad micro-module NFBGA package (6.1 mm  
× 9.1 mm × 1.2 mm)  
The firmware supplied in the on-chip ROM supports a  
complete Bluetooth Link Manager and HCI with  
communication through a UART or USB interface.  
This firmware features point-to-point and point-to-  
multipoint link management, supporting data rates up  
to 723 kbps.  
APPLICATIONS  
Mobile Handsets  
USB Dongles  
Stereo Headsets  
Personal Digital Assistants  
Personal Computers  
Automotive Telematics  
The radio employs an integrated antenna filter and  
switch to minimize the number of external  
components.  
The radio has a heterodyne receiver architecture with  
a low intermediate frequency (IF), which enables the  
IF filters to be integrated on-chip. The transmitter  
uses direct IQ-modulation with Gaussian-filtered bit-  
stream data, a voltage-controlled oscillator (VCO)  
buffer, and a power amplifier.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
Bluetooth is a registered trademark of Bluetooth SIG, Inc.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2013, Texas Instruments Incorporated  

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