OBSOLETE
LMH6560
SNOSA58D –APRIL 2003–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)(3)
Human Body Model(4)
Machine Model(5)
2000V
ESD Tolerance
200V
(7)
Output Short Circuit Duration
Supply Voltage (V+ –V−)
See(6) and
13V
V+ +0.8V, V− −0.8V
235°C
Voltage at Input/Output Pins
Infrared or Convection (20 sec.)
Wave Soldering (10 sec.)
Soldering Information
260°C
Storage Temperature Range
Junction Temperature(3)
−65°C to +150°C
+150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA ) / θJA. All numbers apply for packages soldered directly onto a PC board.
(4) Human body model, 1.5kΩ in series with 100pF
(5) Machine Model, 0Ω in series with 200pF.
(6) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(7) Short circuit test is a momentary test.
Operating Ratings(1)
Supply Voltage (V+ –V−)
Operating Temperature Range(2)(3)
3-10V
−40°C to +85°C
137°C/W
14-Pin SOIC
(2) (3)
Package Thermal Resistance (θJA
)
,
14-Pin TSSOP
160°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA ) / θJA. All numbers apply for packages soldered directly onto a PC board.
(3) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. There is no specification of parametric performance as indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. See APPLICATIONS section for information on temperature de-rating of
this device.
2
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