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LM4890

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LM4890 数据手册

LM4890

Layout Considerations

As output power increases, interconnect resistance (PCB traces and wires) between the amplifier, load

and power supply create a voltage drop. The voltage loss on the traces between the LM4890 and the load

results is lower output power and decreased efficiency. Higher trace resistance between the supply and the

LM4890 has the same effect as a poorly regulated supply, increase ripple on the supply line also reducing the

peak output power. The effects of residual trace resistance increases as output current increases due to higher

output power, decreased load impedance or both. To maintain the highest output voltage swing and

corresponding peak output power, the PCB traces that connect the output pins to the load and the supply pins

to the power supply should be as wide as possible to minimize trace resistance.

The use of power and ground planes will give the best THD+N performance. While reducing trace

resistance, the use of power planes also creates parasite capacitors that help to filter the power supply line.

The inductive nature of the transducer load can also result in overshoot on one or both edges, clamped by

the parasitic diodes to GND and VDD in each case. From an EMI standpoint, this is an aggressive waveform

that can radiate or conduct to other components in the system and cause interference. It is essential to keep

the power and output traces short and well shielded if possible. Use of ground planes, beads, and micro-strip

layout techniques are all useful in preventing unwanted interference.

As the distance from the LM4890 and the speaker increase, the amount of EMI radiation will increase

since the output wires or traces acting as antenna become more efficient with length. What is acceptable EMI is

highly application specific.

Ferrite chip inductors placed close to the LM4890 may be needed to reduce EMI radiation. The value of

the ferrite chip is very application specific.

http://www.hgsemi.com.cn

2014 JUN

9 / 13

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