5秒后页面跳转
LM358AM PDF预览

LM358AM

更新时间: 2024-01-21 00:19:59
品牌 Logo 应用领域
德州仪器 - TI 运算放大器
页数 文件大小 规格书
33页 1663K
描述
LM158/LM258/LM358/LM2904 Low Power Dual Operational Amplifiers

LM358AM 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:SOIC
包装说明:ROHS COMPLIANT, TSSOP-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5
Is Samacsys:N放大器类型:OPERATIONAL AMPLIFIER
架构:VOLTAGE-FEEDBACK最大平均偏置电流 (IIB):0.2 µA
25C 时的最大偏置电流 (IIB):0.15 µA标称共模抑制比:60 dB
频率补偿:YES最大输入失调电压:9000 µV
JESD-30 代码:R-PDSO-G8JESD-609代码:e4
长度:4.4 mm低-失调:NO
湿度敏感等级:1功能数量:2
端子数量:8最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
电源:+-1.5/+-15/3/30 V认证状态:Not Qualified
筛选级别:AEC-Q100座面最大高度:1.2 mm
最小摆率:0.3 V/us标称压摆率:0.6 V/us
子类别:Operational Amplifier最大压摆率:2 mA
供电电压上限:32 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:BIPOLAR
温度等级:COMMERCIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:10
标称均一增益带宽:1100 kHz最小电压增益:25000
宽度:3 mmBase Number Matches:1

LM358AM 数据手册

 浏览型号LM358AM的Datasheet PDF文件第27页浏览型号LM358AM的Datasheet PDF文件第28页浏览型号LM358AM的Datasheet PDF文件第29页浏览型号LM358AM的Datasheet PDF文件第30页浏览型号LM358AM的Datasheet PDF文件第31页浏览型号LM358AM的Datasheet PDF文件第32页 
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

与LM358AM相关器件

型号 品牌 描述 获取价格 数据表
LM358AM/NOPB TI 双路、32V、1MHz 运算放大器 | D | 8 | 0 to 70

获取价格

LM358AMX TI LM158/LM258/LM358/LM2904 Low Power Dual Operational Amplifiers

获取价格

LM358AMX NSC Low Power Dual Operational Amplifiers

获取价格

LM358AMX ONSEMI 双路运算放大器

获取价格

LM358AMX/NOPB TI 暂无描述

获取价格

LM358AN FAIRCHILD Dual Operational Amplifier

获取价格