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LM3311SQX-HIOP PDF预览

LM3311SQX-HIOP

更新时间: 2024-01-24 09:00:47
品牌 Logo 应用领域
美国国家半导体 - NSC 转换器稳压器开关式稳压器或控制器电源电路开关式控制器运算放大器脉冲
页数 文件大小 规格书
32页 2495K
描述
Step-Up PWM DC/DC Converter with Integrated LDO, Op-Amp, and Gate Pulse Modulation Switch

LM3311SQX-HIOP 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFN
包装说明:HVQCCN, LCC24,.16SQ,20针数:24
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.21
模拟集成电路 - 其他类型:SWITCHING REGULATOR控制模式:CURRENT-MODE
控制技术:PULSE WIDTH MODULATION最大输入电压:7 V
最小输入电压:2.5 V标称输入电压:2.5 V
JESD-30 代码:S-XQCC-N24JESD-609代码:e3
长度:4 mm湿度敏感等级:1
功能数量:1端子数量:24
最高工作温度:125 °C最低工作温度:-40 °C
最大输出电流:2.6 A封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装等效代码:LCC24,.16SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:0.8 mm子类别:Switching Regulator or Controllers
表面贴装:YES切换器配置:BOOST
最大切换频率:1280 kHz温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:4 mm
Base Number Matches:1

LM3311SQX-HIOP 数据手册

 浏览型号LM3311SQX-HIOP的Datasheet PDF文件第1页浏览型号LM3311SQX-HIOP的Datasheet PDF文件第2页浏览型号LM3311SQX-HIOP的Datasheet PDF文件第4页浏览型号LM3311SQX-HIOP的Datasheet PDF文件第5页浏览型号LM3311SQX-HIOP的Datasheet PDF文件第6页浏览型号LM3311SQX-HIOP的Datasheet PDF文件第7页 
Pin  
8
Name  
NEG  
Function  
Negative input terminal of the Op-Amp.  
Positive input terminal of the Op-Amp.  
9
POS  
10  
AGND  
Analog ground for the step-up regulator, LDO, and Op-Amp. Connect directly to DAP and PGND  
beneath the device.  
11  
12  
13  
14  
15  
16  
ADJ  
VOUT  
LVIN  
SS  
LDO output voltage feedback input.  
LDO regulator output.  
LDO power input.  
Boost converter soft start pin.  
VC  
Boost compensation network connection. Connected to the output of the voltage error amplifier.  
FREQ  
Switching frequency select input. Connect this pin to VIN for 1.28MHz operation and AGND for  
660kHz operation.  
17  
18  
19  
20  
21  
VIN  
SW  
Boost converter and GPM power input.  
Boost power switch input. Switch connected between SW pin and PGND pin.  
Shutdown pin. Active low, pulling this pin low will disable the LM3311.  
Boost output voltage feedback input.  
SHDN  
FB  
PGND  
Power Ground. Source connection of the step-up regulator NMOS switch and ground for the GPM  
circuit. Connect AGND and PGND directly to the DAP beneath the device.  
22  
23  
CE  
RE  
Connect capacitor from this pin to AGND.  
Connect a resistor between RE and PGND.  
GPM power supply input. VGH range is 5V to 30V.  
24  
VGH  
DAP  
Die Attach Pad. Internally connected to GND. Connect AGND and PGND pins directly to this pad  
beneath the device.  
Block Diagrams  
20126357  
3
www.national.com  

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