LM2904EYxxx-C
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VCC-VEE
VID
36
VCC-VEE
V
V
Differential Input Voltage(Note 1)
Common-mode Input Voltage Range
Output Current(Note 2)
VICMR
IOUT
(VEE - 0.3) to (VEE + 36)
±40
V
mA
Input Current
II
±10
150
mA
°C
Maximum Junction Temperature
Storage Temperature Range
Tjmax
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to VEE or more.
(Note 2) The excessive heat generation may occur due to the short-circuit from the output pin to the power supply pin. Do not use the output pin short to power
supply. Use the output current less than 40mA regardless of the power supply voltage.
Thermal Resistance(Note 3)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 5)
2s2p(Note 6)
SOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 4)
θJA
197.4
21
109.8
19
°C/W
°C/W
ΨJT
SOP-J8
Junction to Ambient
Junction to Top Characterization Parameter(Note 4)
θJA
149.3
18
76.9
11
°C/W
°C/W
ΨJT
MSOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 4)
θJA
284.1
21
135.4
11
°C/W
°C/W
ΨJT
(Note 3) Based on JESD51-2A(Still-Air).
(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 5) Using a PCB board based on JESD51-3.
(Note 6) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
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TSZ22111 • 15 • 001
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01.Oct.2022 Rev.004
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