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LH538700A PDF预览

LH538700A

更新时间: 2024-02-09 01:15:21
品牌 Logo 应用领域
夏普 - SHARP /
页数 文件大小 规格书
6页 61K
描述
CMOS 8M (1M x 8) MROM

LH538700A 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:0.400 INCH, PLASTIC, REVERSE, TSOP2-32Reach Compliance Code:unknown
风险等级:5.92最长访问时间:100 ns
JESD-30 代码:R-PDSO-G32JESD-609代码:e0
长度:21 mm内存密度:8388608 bit
内存集成电路类型:MASK ROM内存宽度:8
功能数量:1端子数量:32
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2-R封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10.2 mmBase Number Matches:1

LH538700A 数据手册

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PRELIMINARY  
LH538700A  
CMOS 8M (1M × 8) MROM  
FEATURES  
PIN CONNECTIONS  
1,048,576 words × 8 bit organization  
TOP VIEW  
32-PIN DIP  
32-PIN SOP  
Access time: 100 ns (MAX.)  
A19  
A16  
A15  
A12  
1
32  
VCC  
Power consumption:  
2
31 A18  
30 A17  
29 A14  
3
4
Operating: 550 mW (MAX.)  
Standby: 550 µW (MAX.)  
A7  
A6  
A5  
A4  
5
6
7
8
28 A13  
27 A8  
Static operation  
26  
25 A11  
24 OE  
23 A10  
CE  
A9  
TTL compatible I/O  
Three-state outputs  
Single +5 V power supply  
A3  
9
A2 10  
A1 11  
22  
A0 12  
D0 13  
21 D7  
20 D6  
19 D5  
Packages:  
D1 14  
32-pin, 600-mil DIP  
32-pin, 525-mil SOP  
32-pin, 400-mil TSOP (Type II)  
D2 15  
18  
17  
D4  
D3  
GND 16  
538700A-1  
Figure 1. Pin Connections for DIP and  
SOP Packages  
DESCRIPTION  
The LH538700A is an 8M-bit mask-programmable  
ROM organized as 1,048,576 × 8 bits. It is fabricated  
using silicon-gate CMOS process technology.  
32-PIN TSOP (Type II)  
TOP VIEW  
A19  
A16  
A15  
1
32  
31  
30  
VCC  
A18  
A17  
2
3
4
5
6
7
8
9
A12  
A7  
A6  
A5  
A4  
A3  
29  
28  
27  
26  
A14  
A13  
A8  
A9  
A11  
OE  
25  
24  
A2  
A1  
10  
11  
23  
22  
A10  
CE  
A0 12  
D0 13  
D1 14  
21 D7  
20  
19  
18  
17  
D6  
D5  
D4  
D3  
D2  
15  
16  
GND  
NOTE: Reverse bend available on request.  
538700A-2  
Figure 2. Pin Connections for TSOP Package  
1

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