Datasheet > LH3330-PF/TRF-16

LH3330-PF/TRF-16

更新时间： 2024-01-17 14:50:11

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立碁电子 - LIGITEK		/
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8页	148K
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LH3330-PF/TRF-16 技术参数

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LH3330-PF/TRF-16 数据手册

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LH3330-PF/TRF-X

Page7/7

Reliability Test:

Reference

Standard

Description

Test Item

Test Condition

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

This test is conducted for the purpose

of detemining the resistance of a part

in electrical and themal stressed.

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

Operating Life Test

The purpose of this is the resistance of

the device which is laid under condition

of high temperature for hours.

High Temperature

Storage Test

1.Ta=105 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

MIL-STD-883:1008

JIS C 7021: B-10

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

Low Temperature

Storage Test

1.Ta=-40℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

JIS C 7021: B-12

1.Ta=65℃±5℃

2.RH=90%~95%

3.t=240hrs ±2hrs

High Temperature

High Humidity Test

The purpose of this test is the resistance

of the device under tropical for hours.

MIL-STD-202:103B

JIS C 7021: B-11

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

1.Ta=105 ℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

Thermal Shock Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

Solder Resistance

Test

1.T.Sol=260 ℃±5℃

2.Dwell time= 10 ±1sec.

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

This test intended to see soldering well

performed or not.

1.T.Sol=230 ℃±5℃

2.Dwell time=5 ±1sec

Solderability Test

1...5 6 78

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