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L515EIR1C PDF预览

L515EIR1C

更新时间: 2024-02-06 01:18:14
品牌 Logo 应用领域
台湾光鼎 - PARALIGHT /
页数 文件大小 规格书
12页 352K
描述
Infrared LED

L515EIR1C 技术参数

生命周期:Contact ManufacturerReach Compliance Code:unknown
风险等级:5.67Base Number Matches:1

L515EIR1C 数据手册

 浏览型号L515EIR1C的Datasheet PDF文件第4页浏览型号L515EIR1C的Datasheet PDF文件第5页浏览型号L515EIR1C的Datasheet PDF文件第6页浏览型号L515EIR1C的Datasheet PDF文件第8页浏览型号L515EIR1C的Datasheet PDF文件第9页浏览型号L515EIR1C的Datasheet PDF文件第10页 
5.0 mm INFRARED EMITTING DIODE  
L515EIR1C  
REV:A / 1  
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to  
avoid stressing the leads (See Fig.3).  
PC board  
Fig.3  
jig  
4) Repositioning after soldering should be avoided as much as possible. If inevitable: select a  
best-suited method that assures the least stress to the LED.  
5) Lead cutting after soldering should be performed only after the LED temperature has returned to  
normal temperature.  
y STORAGE  
1) The LEDs should be stored at 30or less and 70% RH or less after being shipped from PARA  
and the storage life limit is 1 year .  
2) PARA LED lead frames are comprised of a tin plated iron alloy. The surface may be affected by  
environments which contain corrosive gases and so on. Please avoid conditions which may  
cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause  
difficulty during soldering operations. It is recommended that the LEDs be used as soon as  
possible.  
3Please avoid rapid changes in ambient temperature, especially, in high humidity environments  
where condensation can occur.  
DRAWING NO. : DS-23-09-0069  
DATE : 2009-08-10  
Page : 7  

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