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L0805HR127FB PDF预览

L0805HR127FB

更新时间： 2023-03-15 00:00:00
品牌 Logo 应用领域
威世 - VISHAY 电阻器
页数 文件大小 规格书
5页 136K
描述
RESISTOR, THIN FILM, 0.2 W, 1 %, 50 ppm, 0.127 ohm, SURFACE MOUNT, 0805, CHIP

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中文翻译

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L0805HR127FB 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Active包装说明：CHIP
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8533.21.00.30风险等级：5.51
构造：ChipJESD-609代码：e0
安装特点：SURFACE MOUNT端子数量：2
最高工作温度：155 °C最低工作温度：-55 °C
封装长度：1.91 mm封装形状：RECTANGULAR PACKAGE
封装形式：SMT封装宽度：1.27 mm
包装方法：WAFFLE PACK额定功率耗散 (P)：0.2 W
额定温度：70 °C电阻：0.127 Ω
电阻器类型：FIXED RESISTOR系列：LNE(F TOL)
尺寸代码：0805子类别：Fixed Resistors
表面贴装：YES技术：THIN FILM
温度系数：50 ppm/ °C端子面层：Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状：WRAPAROUND容差：1%
工作电压：50 V

L0805HR127FB 数据手册

 浏览型号L0805HR127FB的Datasheet PDF文件第1页浏览型号L0805HR127FB的Datasheet PDF文件第2页浏览型号L0805HR127FB的Datasheet PDF文件第4页浏览型号L0805HR127FB的Datasheet PDF文件第5页 
L
SMD Wraparound Ultra Low Value  
Thin Film Resistors  
Vishay Sfernice  
PACKAGING  
PACKAGING RULES  
Several types of packaging are proposed: waffle-pack and  
tape and reel  
Waffle Pack  
Can be filled up to maximum quantity indicated in the table  
here above, taking into account the minimum order quantity.  
When quantity ordered exceeds maximum quantity of a  
single waffle pack, the waffle packs are stacked up on the top  
of each other and closed by one single cover.  
To get “not stacked up” waffle pack in case of ordered  
quantity > maximum number of pieces per package:  
Please concult Vishay/Sfernice for specific ordering  
code  
NUMBER OF PIECES PER PACKAGE  
TAPE  
SIZE MOQ  
TAPE AND REEL  
WAFFLE PACK  
WIDTH  
2" × 2"  
MIN.  
MAX.  
4000  
2000  
0402  
0603  
0805  
100  
8 mm  
0705  
Tape and Reel  
100  
100  
Can be filled up to maximum quantity indicated in the table  
here above, taking into account the minimum order quantity.  
When quantity ordered is between the MOQ and the  
maximum reel capacity, only one reel is provided.  
When several reels are needed for ordered quantity  
within MOQ and maximum reel capacity: Please consult  
Vishay Sfernice for specific ordering code  
1206  
1505  
2010  
140  
60  
8 mm (1)  
Note  
(1) 12 mm on request  
•
Size 2512 under development  
PERFORMANCE  
VALUES AND DRIFT  
TESTS  
CONDITIONS  
MIL-R-55342  
TYPICAL  
REQUIREMENTS  
PERFORMANCES  
MIL-R-55342 C  
MIL-STD-702-Method 107  
Thermal shock  
0.25 %  
0.10 %  
0.25 %  
0.25 %  
0.02 %  
0.01 %  
0.01 %  
0.04 %  
MIL-R-55342 C  
PARA 3.10.4.7.5  
Short time overload  
MIL-R-55342 C  
PARA 3.9 and 4.7.4  
Low temperature operation  
Resistance to solder heat  
MIL-R-55342 C  
PARA 3.12, 4.7.7, 4.7.1.2  
MIL-R-55342 C  
PARA 3.13 and 4.7.8  
MIL-STD-202-Method 106  
Moisture resistance  
High temperature  
Load life  
0.40 %  
0.20 %  
0.50 %  
0.01 %  
0.075 %  
0.15 %  
MIL-R-55342 C  
PARA 3.11 and 4.7.6  
MIL-R-55342 C  
2000 h Pn at 70 °C  
MIL-STD-202-Method 108  
Document Number: 53018  
Revision: 29-Oct-09  
For technical questions, contact: sfer@vishay.com  
www.vishay.com  
59  
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